Articles

  • 1 week ago | 5gtechnologyworld.com | Aharon Etengoff

    Network slicing, which makes private networks possible, provides enterprises with dedicated network resources. It works by interacting with a set of network functions. Part 1 of this series covered how 5G network slicing enables operators to deploy, modify, and scale customized virtual networks, along with key slicing techniques and connectivity models.

  • 2 weeks ago | 5gtechnologyworld.com | Aharon Etengoff

    Network slicing, which makes private networks possible, provides enterprises with dedicated network resources. It works by interacting with a set of network functions. The 3GPP defines network slicing as a core 5G feature. It partitions a single physical network into multiple virtual network slices. Each slice operates as an independent end-to-end network optimized for specific applications and services.

  • 3 weeks ago | designworldonline.com | Aharon Etengoff

    Medical devices of all sizes and types rely on connectors to ensure safe and reliable power delivery, data transmission, and fluid management. Many of these medical-grade connectors are rated for biocompatibility (ISO 10993), environmental sealing (IEC 60529), and electromagnetic interference (EMI) resistance (IEC 60601-1-2). This article highlights various medical connectors, such as implantable devices, card-edge solutions, and board-level interconnects.

  • 3 weeks ago | connectortips.com | Aharon Etengoff

    Medical devices of all sizes and types rely on connectors to ensure safe and reliable power delivery, data transmission, and fluid management. Many of these medical-grade connectors are rated for biocompatibility (ISO 10993), environmental sealing (IEC 60529), and electromagnetic interference (EMI) resistance (IEC 60601-1-2). This article highlights various medical connectors, such as implantable devices, card-edge solutions, and board-level interconnects.

  • 3 weeks ago | eeworldonline.com | Aharon Etengoff

    Artificial intelligence (AI) and machine learning (ML) applications consume significant power and generate considerable heat in data centers. High-performance AI accelerators — such as graphics processing units (GPUs), tensor processing units (TPUs), and application-specific integrated circuits (ASICs) — increasingly require more efficient cooling methods to maintain safe and optimal thermal operating levels.

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