
Anton Shilov
Contributor at EE Times
Contributor at Tom's Hardware
Articles
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5 days ago |
tomshardware.com | Anton Shilov
Following multiple rounds of restrictions imposed on semiconductor production equipment sales to China, the country's foundry champion, Semiconductor Manufacturing International Corporation (SMIC), is finally feeling the effects. This week, the company reported output disruptions caused by equipment maintenance and new equipment validation, which will reduce its revenues for the second quarter by up to 6%, according to DigiTimes. SMIC ran into two yield and output-related issues recently.
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6 days ago |
tomshardware.com | Anton Shilov
Nvidia plans to introduce a cut-down version of its HGX H20 AI processor in China by July, aiming to retain access to the market after U.S. officials effectively barred the original version through updated export regulations, Reuters reports. According to preliminary information, the revised AI GPU will feature less onboard HBM memory to comply with newly imposed technical limits and replace the previously approved model.
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6 days ago |
flipboard.com | Anton Shilov
1 hour agoThis is the funny moment mini pigs were captured taking turns diving into a swimming pool. The video, filmed in Zhejiang, China, shows the mini pigs on a platform as their owner encourages them. The little piglets can be seen leaping off the platform without hesitation and diving straight into the water. The video was filmed on April 28, 2025.
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6 days ago |
tomshardware.com | Anton Shilov
The first benchmark results of Nvidia's GB10 Superchip for compact AI workstations in Geekbench 6 have been published. While the processor promises serious performance for AI applications, its compute capabilities seem relatively modest. The CPU trails behind Apple's entry-level M3 and Qualcomm's higher-end Snapdragon X Elite system-on-chip (SoC), and we are not even talking about high-end offerings.
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6 days ago |
tomshardware.com | Anton Shilov
A former SK Hynix employee has been formally accused of illegally transferring technologies related to advanced chip packaging used for 3D NAND, HBM, and multi-chiplet assemblies as well as CMOS image sensors to Huawei's HiSilicon division, reports DigiTimes citing the Seoul Central District Prosecutor's office. There is an interesting wrinkle in this story: Huawei's HiSilicon did not directly ask for specific technologies.
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