Barbara Della Porta

3 weeks ago | eetimes.eu | Barbara Della Porta

Longsys(301308.SZ), a branded semiconductor enterprise, will exhibit at COMPUTEX 2025 from May 20 to 23 at the Taipei Nangang Exhibition Center, under the theme “Storage Meets AI.” As artificial intelligence continues to drive innovation across devices and infrastructure, Longsys will unveil a comprehensive portfolio of high-performance, high-capacity, and highly reliable storage solutions built for AI-era applications.

1 month ago | eetimes.eu | Barbara Della Porta

Bristol, United Kingdom – 30, April 2025 – Vicinity Technologies Limited (“Vicinity”), a leader in 5G wireless technology, has announced a groundbreaking partnership with EnSilica plc to drive the next generation of satellite-based mobile connectivity. The two companies have been awarded over £10 million in funding under the UK Space Agency’s Connectivity in Low Earth Orbit (C-LEO) programme.

1 month ago | eetimes.eu | Barbara Della Porta

As global industries pivot toward cleaner, smarter, and more efficient energy systems, power semiconductors are increasingly recognized as a critical enabler of this transformation. Right among them, silicon carbide (SiC) has emerged as a game-changing material, outperforming traditional silicon in high-voltage, high-temperature, and high-efficiency applications. FuYi PowerTech, a rising force in power electronics innovation, has rapidly positioned itself as a key player in the SiC MOSFET space.

2 months ago | eetimes.eu | Barbara Della Porta

“Nessum” is Panasonic Holdings’ wired communication technology that enables speed upgrade, extension, and IP transition of networks using existing lines. Nessum, which has been rebranded from its predecessor “HD-PLC,” is expected to expand its scope of applications to networks that complement existing wired/wireless communication technologies and realize IoT transition at a low cost.

Feb 28, 2025 | eetimes.eu | Barbara Della Porta

Building on the innovation of ultra-compact 7.2mm x 7.2mm eMMC, Longsys (SZ.301308) now presents its latest advancement ideal for wearable storage use cases—the ultra-thin 0.6mm (max) ePOP4x, which enables a more streamlined and efficient device layout. With a maximum thickness of just 0.6mm, it is nearly 25% thinner than its predecessor (0.8mm), making it one of the slimmest ePOP products available on the market.