Bill Wong

Yardley

Senior Technology Editor at Electronic Design

Senior Content Director at Power Electronics

Senior Content Director at Microwaves & RF

Senior Content Director at Endeavor Business Media

Technology Editor for Electronic Design covering digital, embedded, systems and software. Interests include robotics, programming and gaming.

Articles

When You Really Need Rugged

Dec 3, 2024 | electronicdesign.com | Bill Wong

What you'll learn: Where ceramic packaging and substrates are employed. Why designing solutions with ceramic packaging and substrates is challenging. Ceramic packaging and substrates address high-performance and reliability requirements for many electronic applications, especially those found in rugged systems or where consistency and reliability are critical factors. This is particularly apparent in the RF and microwave space.
Using a 3D-Printed Gradient Index Refracted Lens

Nov 26, 2024 | electronicdesign.com | Bill Wong

What you'll learn: What is a gradient index refracted lens? How are 3D GRIN lenses used? Gradient index (GRIN) lens antennas are utilized in wireless-communications applications such as satellite and radar systems. They can support directional beamforming as well as multibeam and beamsteering microwave applications. The trick is getting the right lens for an application, which usually means a custom antenna. 3D printing can address this issue.
Microwave Testing Using MilliBox’s Anechoic Chamber

Nov 22, 2024 | mwrf.com | Bill Wong

What you’ll learn:What is an RF anechoic chamber? Why a compact, modular MBX0x solution is useful. Anechoic chambers are environments used to test audio or RF equipment. The term anechoic means "free from echoes and reverberations." It’s essentially a room that prevents echoes. The audio and RF versions are quite different, although they tend to look similar since one prevents audio echoes while the other prevents reflection of radio waves, typically microwaves.
Electronic Design's Focus Amid Changing Times

Nov 18, 2024 | electronicdesign.com | Bill Wong

The upcoming November/December issue of Electronic Design wraps up over 70 years of regular print and then PDF versions of our issues, which subscribers have been reading over all these years. Our 75th anniversary will be in 2027. Electronic Design has had an online digital focus for a long time. We have more articles than would fit into the print issues since I started with Electronic Design in 2000. We picked the best to go into the print edition and lately the PDF version.
Taking a Closer Look at Rohde & Schwarz Test Equipment

Nov 13, 2024 | mwrf.com | Bill Wong

Technologies Test & MeasurementWhat you’ll learn:What’s new with the SMW200A vector signal generator? Functionality provided by the Integrated Record, Analysis, Playback System (IRAPS). Features of the ATS1800C over-the-air (OTA) test chamber. I recently talked with Wally Arceneaux, Industry Segment Manager at Rohde & Schwarz, about a number of products, including the R&S SMW200A vector signal generator (VSG), at IMS 2024 (watch the video above). The SMW200A (Fig.
Virtual Antenna Supports Multiple Standards

Nov 12, 2024 | mwrf.com | Bill Wong

Ignion's Virtual Antenna design is an alternative to the more common flexible printed circuit (FPC), also known as a “sticker antenna.” The FPC, with its an adhesive backing strip and cable, is used in compact IoT wireless applications. FPCs require precise cable routing and assembly to deliver optimum performance. Improper design or assembly can result in suboptimal performance in the field.
Multicore Micro Targets Software-Defined Vehicle Tasks

Nov 11, 2024 | electronicdesign.com | Bill Wong

The AURIX TC4Dx incorporates six 500-MHz TriCore cores. There's also a parallel processing unit (PPU) SIMD vector DSP that takes on artificial-intelligence and machine-learning (AI/ML) chores. They handle real-time applications such as battery-management systems (BMS), vehicle motion control and motor control, as well as chassis support. The low-latency interconnect (LLI) is designed to tie the high-resolution PWMs and eGTM timers with the PPU.
Highlights from the RISC-V Summit 2024

Nov 8, 2024 | electronicdesign.com | Bill Wong

Accelerating AI LLM Model Using RISC-V P-ExtensionsAndes Technology's Yueh-Feng Lee presented LLM Inference on RISC-V Embedded CPUs. This presentation highlights the capabilities of the RISC-V P-extensions for packed SIMD instructions and how they can be used to accelerate artificial-intelligence (AI) large language models (LLMs). There's a mention of the company's QiLai SoC, which is being developed in conjuction with DeepComputing for an AI-accelerated PC.
Examining EV Charging Infrastructure Issues

Nov 1, 2024 | electronicdesign.com | Bill Wong

Electric vehicles (EVs) run on batteries that require periodic charging. A charging infrastructure is required to provide this power. I talked with Jeff Postelwait, Managing Editor at tdworld.com, and Janelle Penny, Editor in Chief at buildings.com, about some of the issues associated with building out the EV charging infrastructure. You can check out some Electronic Design articles below about EV charging, including wireless-charging technologies.
What's the Difference Between PCIe Gen 5 and Gen 6?

Oct 31, 2024 | electronicdesign.com | Bill Wong

The FLIT-based encoding is also part of the PAM4 modulation scheme. It works in tandem with the FEC and CRC; thus, the 2x bandwidth improvement can be real. FLIT also required an updated packet layout to simplify processing and hardware design. In addition, it allows for additional functionality to be included in the packet.