Canhui Yang

Jul 18, 2024 | nature.com | Xing Cheng |Canhui Yang |Fuzeng Ren

AbstractStretchable electronics commonly assemble multiple material modules with varied bulk moduli and surface chemistry on one packaging substrate. Preventing the strain-induced delamination between the module and the substrate has been a critical challenge. Here we develop a packaging substrate that delivers mechanically stable module/substrate interfaces for a broad range of stiff and stretchable modules with varied surface chemistries.