Caroline Hayes
Editor at Electronics Weekly
Technology Writer at Freelance
Editor at Softei.com
Editor at Weartech Design
News, views and articles from the global electronics industry by Electronics Weekly Editor, Caroline Hayes.
Articles
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2 weeks ago |
electronicsweekly.com | Caroline Hayes
Developed by Tria Technologies, an Avnet company, the boards are for embedded designs in the industrial, medical, agriculture and construction sectors, as well as edge computing, machine learning and AI. The low-power Qualcomm Dragonwing processors have edge AI and seamless networking capabilities and are scalable. The company says that the new modules offer a “powerful CPU and AI combination at lowest power consumption”.
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3 weeks ago |
electronicsweekly.com | Caroline Hayes
As well as categories to showcase design excellence, did you know we have some new categories this year, designed to bring out the best personal qualities and corporate ethos that make people proud. Some of this year’s categories are designed to bring out individual strengths:Entrepreneurial Star – Are you a young (under 35 years) entrepreneur of the electronics industry?
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4 weeks ago |
electronicsweekly.com | Caroline Hayes
The Cissoid CMT-PLA3SB12340A SiC mosfet intelligent module is available from the distributor with reference designs for customisation. Applications include power systems for electric cars, buses, trucks, lorries and heavy-duty industrial plant equipment as well as electric boats, aviation and industrial motor control. TheSiC mosfet intelligent power module has an open-source design for developers to customise the module.
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4 weeks ago |
electronicsweekly.com | Caroline Hayes
The modular SL2000 is designed to capture fast signal transients and long-term trends in R&D, validation, and troubleshooting in automotive, aerospace, marine and rail applications as well as data centres, energy generation and storage and robotics systems. It can be used for durability and reliability testing of components and vehicles that requires high sampling rates and multi-channel simultaneous measurement of analogue signals and in-vehicle bus signals, such as CAN and CAN FD.
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1 month ago |
electronicsweekly.com | Caroline Hayes
In addition to side-to-side and front-to-back mounting, the assemblies allow belly-to-belly PCB mounting (connectors and cages on both sides of a PCB) near the IC package, to reduce board space and for secure placement under heat sinks or other cooling hardware. Each cable assembly provides 112Gbps PAM4 channel rate in a two-row, 16-pair design with aggregate data rates of 896Gbps (x8 bi-directional) or 1.79Tbps (x16 uni-directional). Each is PCIe 6.0/CXL 3.2-capable.
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