Articles

  • 2 weeks ago | globalseafood.org | Hank Hogan

    Oregon’s OoNee Sea Urchin Ranch is ramping up its land-based sea urchin farm using RAS technologyOften likened to cockroaches, zombies and sheep, sea urchin populations have gotten out of balance within ecosystems along the West Coast of the United States and some coastal areas of eastern Asia. As a result, the spiky critters can clear-cut a kelp forest, leaving hundreds of dormant sea urchins to litter the ocean floor, lying in wait to attack any regrowth.

  • Mar 25, 2025 | photonics.com | Hank Hogan

    Innovations in wavelength and pulse control allow LEDs to be more efficient in industrial settings, and developers say lighting should be considered at the start of system design. For potent implementation of light-emitting diodes (LEDs) and light sources in machine vision applications, illumination needs must be integrated into the initial system design.

  • Mar 4, 2025 | spie.org | Hank Hogan

    Unlike what happens in Las Vegas, what happens in a wafer fab doesn’t stay there. That’s why the use of PFAS (Per- and Polyfluoroalkyl Substances) materials in semiconductor manufacturing is a concern. In lithography, PFAS plays crucial roles in the patterning of photoresist, and they present long term health and environmental hazards.

  • Mar 4, 2025 | spie.org | Hank Hogan

    Most semiconductor lithography involves projecting a mask pattern onto a photoresist coated wafer, developing the exposed resist, and using that resist to transfer the pattern onto layers of insulators, conductors, and other circuit elements on the wafer. Repeating this process over and over eventually creates a complete integrated circuit like a microprocessor or memory.

  • Mar 3, 2025 | spie.org | Hank Hogan

    Chips are headed up and down. So, lithography and related technologies will help that happen, according to presentations at the 2025 SPIE Advanced Lithography + Patterning conference. Moore’s Law calls for a doubling of transistor counts within a packaged device every two years. For decades lithography and patterning enabled this scaling up in transistor density. Transistors got smaller in length, width, and height, allowing more of them to be packed into a given area.

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