Huifeng Zhao

Dec 14, 2023 | dx.doi.org | Huifeng Zhao |Dejun Jiang |Chao Shen |Jintu Zhang

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Jul 15, 2023 | onlinelibrary.wiley.com | Yijun Zhang |Huifeng Zhao |Tianyi Yan |Wei Ren

Abstract Capacitors are ubiquitous and crucial components in modern technologies. Future microelectronic devices require novel dielectric capacitors with higher energy storage density, higher efficiency, better frequency and temperature stabilities, and compatibility with integrated circuit (IC) processes. Here, in order to overcome these challenges, a novel 3D HfO2 thin film capacitor is designed and fabricated by an integrated microelectromechanical system (MEMS) process.

Jul 14, 2023 | pericles.pericles-prod.literatumonline.com | Yijun Zhang |Huifeng Zhao |Tianyi Yan |Wei Ren

Abstract Capacitors are ubiquitous and crucial components in modern technologies. Future microelectronic devices require novel dielectric capacitors with higher energy storage density, higher efficiency, better frequency and temperature stabilities, and compatibility with integrated circuit (IC) processes. Here, in order to overcome these challenges, a novel 3D HfO2 thin film capacitor is designed and fabricated by an integrated microelectromechanical system (MEMS) process.