Jaria Martin

Nov 5, 2024 | jdsupra.com | Nancy Fischer |Aimee Ghosh |Jaria Martin

Under the Department of Commerce, the program will provide funding for research and development projects to support U.S. semiconductor advanced packaging and strengthen the manufacturing and packaging workforce. Takeaways The Biden Administration released a new Notice of Funding Opportunity (NOFO), to create and accelerate domestic semiconductor advanced packaging through five research and development (R&D) areas.

Jun 16, 2023 | pillsburylaw.com | Tony Phillips |Jaria Martin

Since the 4th Circuit’s decision in Zeran v. America Online, Inc., created “a federal immunity to any cause of action that would make service providers liable for information originating with a third-party user of the service,” Section 230 has immunized companies from the threat of litigation arising from most content appearing on their platforms, enabling the Internet to accelerate and expand around the world.