Articles

  • Apr 8, 2024 | mdpi.com | Tongliang Liu |Jianmin Wen |Ping Zhang

    All articles published by MDPI are made immediately available worldwide under an open access license. No specialpermission is required to reuse all or part of the article published by MDPI, including figures and tables. Forarticles published under an open access Creative Common CC BY license, any part of the article may be reused withoutpermission provided that the original article is clearly cited. For more information, please refer tohttps://www.mdpi.com/openaccess.

  • Jan 24, 2024 | preprints.org | Tongliang Liu |Jianmin Wen

    Preprint Article Version 1 This version is not peer-reviewed Version 1 : Received: 23 January 2024 / Approved: 24 January 2024 / Online: 24 January 2024 (21:13:59 CET) Liu, T.; Wen, J. Study on Dynamic Coupling Behavior of End-Meshing Harmonic Reducer. Preprints 2024, 2024011735. https://doi.org/10.20944/preprints202401.1735.v1 Liu, T.; Wen, J. Study on Dynamic Coupling Behavior of End-Meshing Harmonic Reducer. Preprints 2024, 2024011735.

  • Jan 16, 2024 | preprints.org | Tongliang Liu |Jianmin Wen

    Preprint Article Version 1 This version is not peer-reviewed Version 1 : Received: 16 January 2024 / Approved: 16 January 2024 / Online: 16 January 2024 (08:38:26 CET) Liu, T.; Wen, J. Research on Deployment Process Dynamics and Vibration for Replaceable Interface Mast. Preprints 2024, 2024011207. https://doi.org/10.20944/preprints202401.1207.v1 Liu, T.; Wen, J. Research on Deployment Process Dynamics and Vibration for Replaceable Interface Mast. Preprints 2024, 2024011207.

  • Mar 14, 2023 | mdpi.com | Xiaomeng Liu |Bindi You |Rui Wang |Jianmin Wen

    This is an early access version, the complete PDF, HTML, and XML versions will be available soon. Open AccessArticlebyXiaomeng Liu 1, Bindi You 2, Rui Wang 2,*, Jianmin Wen 2,*, Dexiao An 1 and Xiaolei Wen 2 1School of Astronautics, Harbin Institute of Technology, Harbin 150001, China2School of Ocean Engineering, Harbin Institute of Technology, Weihai 264209, China*Authors to whom correspondence should be addressed.

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