Maurizio Di Paolo Emilio
Content Editor, AspenCore at EE Times
Editor In Chief at Power Electronics News
Editor. Technical writer, Engineer and Ph.D - Power Electronics and Embedded Design Technology #powerelectronics #GaN #SiC #energy #quantum #embedded
Articles
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1 week ago |
embedded.com | Maurizio Di Paolo Emilio
Embedded Web Server, CrowPanel ESP32 Display Management, Countering GNSS Spoofing: Embedded Week InsightsHere’s a RoundUp of this week’s must-read articles – we’ll delve into the latest developments on Embedded Web Server, CrowPanel ESP32 Display Management, and Countering GNSS Spoofing!X-FAB Silicon Foundries SE has introduced a new isolation class to its 180nm XH018 semiconductor process, aimed at advancing the integration and efficiency of single-photon avalanche diode (SPAD) technology.
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1 week ago |
embedded.com | Maurizio Di Paolo Emilio
X-FAB Unveils Advanced Isolation Class for 180nm SPAD Integration, Enabling Higher Density and Performance in Photon Detection ApplicationsX-FAB Silicon Foundries SE has introduced a new isolation class to its 180nm XH018 semiconductor process, aimed at advancing the integration and efficiency of single-photon avalanche diode (SPAD) technology.
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1 week ago |
embedded.com | Maurizio Di Paolo Emilio
Toshiba Introduces High-Speed, Dual-Channel Digital Isolators for Enhanced Automotive System ReliabilityToshiba Electronics Europe GmbH (“Toshiba”) has expanded its portfolio of isolation devices by launching four new AEC-Q100 qualified, 2-channel high-speed digital isolators. These additions, categorized under the DCM32xx00 series, are engineered to deliver robust performance with a typical common-mode transient immunity (CMTI) of 100kV/µs and support data transmission rates of up to 50Mbps.
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1 week ago |
embedded.com | Maurizio Di Paolo Emilio
Jabil to Invest $500 Million in U.S. Manufacturing Expansion for Cloud and AI Data CentersJabil Inc. has announced plans to invest approximately $500 million over the coming years to expand its presence in the Southeastern United States, aiming to better support customers in the cloud and AI data center infrastructure sectors. This substantial investment will drive the development of new large-scale manufacturing capabilities, capital expenditures, and initiatives for workforce growth.
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2 weeks ago |
embedded.com | Maurizio Di Paolo Emilio
Onsemi’s Treo Platform, Co-Packaged Optics, Time Sensitive Networking: Embedded Week InsightsHere’s a RoundUp of this week’s must-read articles – we’ll delve into the latest developments on Onsemi’s Treo Platform, Co-Packaged Optics, and Time Sensitive Networking!Alice & Bob, a global frontrunner in the pursuit of fault-tolerant quantum computing, unveiled at GTC Paris the ongoing integration of its quantum simulation library Dynamiqs with the NVIDIA CUDA-Q platform.
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https://t.co/VdV6iujoX2 Here’s a RoundUp of this week’s must-read articles – we’ll delve into the latest developments on 100kW Charging Brick, GaN, Energy Harvesting, and Motor Control! Also, check News Archives – Power Electronics News and Technical Articles Archives – Powe…
https://t.co/kAqyF9WFCv In this video, we will showcase a universal input (85V-260V AC) to 12V-3A DC Flyback power supply, delivering 36W of stable output power. The design uses an affordable PWM controller and an external MOSFET, running at 65kHz switching frequency, optimiz…
https://t.co/VmrL1Uo4zW Here’s a RoundUp of this week’s must-read articles – we’ll delve into the latest developments on Neural Networks with TinyML, TSMC Technology Symposium Europe, Hallucinations AI, and Ghost States! Also, check News Archives – Embedded and Technical Arti…