Peter Brown

California, New York, United States

Senior Editor and Writer at Electronics 360

Associate Editor at Assignment X Magazine

I write about Tech for @electronics_360 and about pop culture for @Assignmentx | huge nerd, lover of horror and SciFi movies.

Articles

Report: Intel’s 18 A process attracting big players

1 week ago | electronics360.globalspec.com | Peter Brown

Intel Foundry’s 18 A process technology is apparently in talks to land some big deals in the form of Microsoft, Google and Nvidia. According to a report from Tom’s Hardware, Nvidia is looking to manufacture a GPU aimed at gamers with Intel Foundry in what would be a major win for the semiconductor manufacturing wing of Intel Corp. Additionally, Google is apparently in talks with Intel Foundry for future chips for a range of applications.
Imaging radar chip doubles power processing

1 week ago | electronics360.globalspec.com | Peter Brown

Imaging radar processors are key to the perception systems that will enable a variety of current and future automotive segments like autonomous driving, advanced driver assistance systems (ADAS), automated parking and more. Imaging radar uses point cloud data for detailed modeling of the environment so that vehicles can navigate and avoid complex urban scenarios that emerge while driving.
Expect shortages, higher costs amid China’s rare Earth cuts

1 week ago | electronics360.globalspec.com | Peter Brown

In April 2025, China imposed even further export restrictions on seven additional medium and heavy rare Earth elements — samarium, gadolinium, terbium, dysprosium, lutetium, scandium and yttrium — in response to the Trump Administration’s tariffs on the country. These elements were added to the already restricted sale of other rare Earth elements from 2024 to the U.S. including gallium, germanium and antimony.
23% of US households have at least 1 smart appliance

1 week ago | electronics360.globalspec.com | Peter Brown

The adoption of smart appliances continues to grow, albeit slowly, with 23% of U.S. internet homes owning at least one smart appliance, according to new data from Parks Associates. In 2020, only 15% of U.S. internet households owned at least one smart appliance. This slow growth is due to high prices, long replacement cycles and limited differentiation among competitors, Parks Associates said.
Cadence expands enterprise PC platform

1 week ago | electronics360.globalspec.com | Peter Brown

Cadence Design Systems has expanded its Millennium Enterprise Platform with the introduction of the M2000 supercomputer with integrated Nvidia Blackwell systems. The supercomputer delivers AI-accelerated simulations at scale across different designs. The company unveiled the system at its annual CadenceLIVE Silicon Valley 2025.
Report: AMD may use TSMC, not Samsung, for future chips

1 week ago | electronics360.globalspec.com | Peter Brown

Samsung’s foundry challenges are growing as a new report said that microprocessor giant AMD will shift its 4 nm semiconductor orders away from Samsung and to Taiwan Semiconductor Manufacturing Co. (TSMC). According to a report from Wccftech, AMD’s decision may be also due to TSMC’s American operations. TSMC is currently building three state-of-the-art semiconductor fabs in Phoenix, Arizona, with plans to start construction on a fourth fab soon.
SiC MOSFETs now easier to integrate into legacy systems

1 week ago | electronics360.globalspec.com | Peter Brown

Looking to make it easier to drop silicon carbide (SiC) power metal-oxide-semiconductor field-effect transistors (MOSFETs) into legacy systems and to enable the next generation of power converter designs, NoMIS Power unveiled advancements in its 1.2 kV planar MOSFETs. These advancements include reductions in on-resistance by optimizing device design and process steps. The SiC MOSFETs achieve an on-resistance of 2.5 mΩ-cm2 at room temperature with a gate oxide thickness of 50 nm.
LoRaWAN integrated into Toggled’s IoT platform

1 week ago | electronics360.globalspec.com | Peter Brown

Toggled, a subsidiary of Altair, has integrated long range wide area network (LoRaWAN) sensor technology into its Toggled iQ platform, an internet of things (IoT) system for smart buildings and facilities. The platform allows building owners and facility managers to build a private and secure network for real-time monitoring and automation. LoRaWAN allows the platform to connect to sensors even in large buildings and industrial sites through walls and floors where Wi-Fi may not be stable.
First clock generator with integrated MEMS resonator

1 week ago | electronics360.globalspec.com | Peter Brown

SiTime Corp. has unveiled its first mobile clock generator with an integrated microelectromechanical systems (MEMS) resonator. Called the SiT30100 provides clock signals for 5G and GNSS chipsets for efficient power consumption in mobile and internet of things (IoT) devices like smartphones, tablets, laptops and asset trackers. “Every generation of mobile devices becomes smarter, delivering greater functionality, personalization and automation,” said Rajesh Vashist, CEO and chairman of SiTime.
TSMC breaks ground on third Arizona fab

2 weeks ago | electronics360.globalspec.com | Peter Brown

Taiwan Semiconductor Manufacturing Co. (TSMC) has broken ground on the third semiconductor manufacturing facility at its campus in Phoenix, Arizona. Under the Investment Accelerator Program, the third fab will manufacture semiconductors used in artificial intelligence, data centers and smartphones. The fab is part of TSMC’s $100 billion investment that is expected to create 40,000 construction jobs over the next four years and tens of thousands of high-tech jobs.