Susan Nordyk

United States

Contributing Editor at EDN: Voice of the Engineer

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Articles

IC safeguards NFC communication

1 week ago | edn.com | Susan Nordyk

The NTAG X DNA from NXP is an ISO/IEC 14443-4 Type 4 NFC tag that enables secure authentication of NFC-enabled mobile devices. It features 16 kB of memory, high-speed data transfer, and Secure Unique NFC (SUN) authentication to protect devices across healthcare, smart home, consumer electronics, and industrial markets.
Dry film photoresist enables fine circuit formation

1 week ago | edn.com | Susan Nordyk

Asahi Kasei has developed the Sunfort TA series of dry film photoresist for next-generation semiconductor packages requiring circuit patterns with line/space widths of 2/2 µm or less. The film offers high resolution with conventional stepper and laser direct imaging (LDI) systems—used to transfer circuit patterns onto substrates—enhancing precision in back-end processes. The TA series supports fine wiring formation in panel-level packages and related applications.
Power doublers enable smooth DOCSIS 4.0 upgrades

1 week ago | edn.com | Susan Nordyk

Qorvo’s QPA3311 and QPA3316 hybrid power doubler amplifiers are optimized for DOCSIS 4.0 downstream operations up to 1.8 GHz. They support the transition to Unified DOCSIS and smart amplifier architectures that enhance visibility, efficiency, and adaptability in hybrid fiber-coax (HFC) systems. Based on a GaAs/GaN die, the devices operate from 45 MHz to 1794 MHz and provide 23 dB of gain. They are well-suited for DOCSIS 4.0 CATV nodes and amplifiers.
Antenna-matching ICs cut RF design complexity

1 week ago | edn.com | Susan Nordyk

ST offers three antenna-matching companion chips for STM32WL33 wireless MCUs to help streamline the development of IoT, smart metering, and remote monitoring systems. The MLPF-WL-01D3, MLPF-WL-02D3, and MLPF-WL-04D3 integrate impedance matching and harmonic filtering on a single glass substrate to boost RF performance. By integrating antenna protection, matching, and filtering, the devices simplify RF routing, improve reliability, and reduce BOM cost by replacing multiple discrete components.
Wireless SoCs drive IoT efficiency

1 week ago | edn.com | Susan Nordyk

Built on a 22-nm process, Silicon Labs’ SiXG301 and SiXG302 wireless SoCs deliver improved compute performance and energy efficiency. As the first members of the Series 3 portfolio, they target both line- and battery-powered IoT devices.
PSU combines GaN and SiC for hyperscale AI

2 weeks ago | edn.com | Susan Nordyk

Navitas announced a production-ready 12-kW PSU reference design that achieves 97.8% efficiency for hyperscale AI data centers with 120-kW rack densities. The design incorporates three-phase interleaved TP-PFC and FB-LLC stages, implemented using Gen-3 Fast SiC MOSFETs and 4th-generation high-power GaNSafe ICs, respectively. The GaNSafe ICs integrate control, drive, sensing, and essential protection functions, while IntelliWeave digital control enhances overall performance.
MCU enables neuromorphic processing at the edge

2 weeks ago | edn.com | Susan Nordyk

As Innatera’s first mass-market neuromorphic MCU, Pulsar delivers intelligence at the edge by emulating the brain’s neural networks. It uses Spiking Neural Networks that process only changes in input—enabling real-time decision making with significantly reduced energy and latency. According to Innatera, Pulsar achieves up to 100× lower latency and 500× lower energy consumption compared to conventional AI processors.
Platform helps secure in-vehicle connectivity

2 weeks ago | edn.com | Susan Nordyk

NXP’s OrangeBox 2.0 automotive connectivity domain controller features an upgraded CPU and embedded AI acceleration. This second-generation development platform facilitates secure connectivity between the vehicle’s gateway and its wired and wireless systems in domain- and zonal-based architectures. Powered by the i.MX 94 applications processor, OrangeBox 2.0 delivers 4× the CPU performance of its predecessor.
PCIe card provides FPGA-based data acceleration

2 weeks ago | edn.com | Susan Nordyk

Powered by the Achronix Speedster 7t1500 FPGA, the VectorPath 815 PCIe accelerator card meets the performance demands of AI and HPC workloads. Speedster FPGAs integrate machine learning processors to deliver a massively parallel architecture, customizable data paths, and efficient processing of sparse and irregular computations.
Toshiba shrinks SiC MOSFETs with DFN package

2 weeks ago | edn.com | Susan Nordyk

Toshiba has released four 650-V third-generation SiC MOSFETs in compact 8×8-mm DFN packages. The surface-mount DFN reduces volume by over 90% compared to leaded packages such as TO-247 (3-terminal) and TO-247-4L(X) (4-terminal). It also enables smaller parasitic impedance components, helping to lower switching losses. The package’s flat, leadless design enables a Kelvin connection for the gate-drive signal-source terminal, minimizing source wire inductance.