Yu-Han Chang

Jan 27, 2025 | idtechex.com | Sam Dale |Yu-Han Chang |Sample pages

What are the benefits and challenges for Silicon Photonics and Photonic Integrated Circuits? Photonic Integrated Circuits (PICs) are tiny optical systems made out of materials such as Silica (Glass), Silicon, or Indium Phosphide. PICs enable everything from complex optical designs that allow billions of bits of information to be sent and received in a package the size of a candy bar to artificial noses that can detect different compounds and molecules in the air around them.

Dec 2, 2024 | us-tech.com | Yu-Han Chang

The rise of co-packaged optics (CPO) is transforming modern data centers and high-performance networks by addressing critical challenges such as bandwidth density, energy efficiency, and scalability. CPO enhances interconnect bandwidth and energy efficiency by integrating optics and electronics within a single package, significantly shortening electrical link lengths. This innovation is crucial as data center traffic surges, driven especially by AI and high-performance computing.

Nov 19, 2024 | idtechex.com | Yu-Han Chang

Designing energy-efficient systems that meet the high bandwidth demands of high-performance computing (HPC) involves key trends in silicon technology: increasing transistor density, enhancing memory capacity, and boosting interconnections between logic ICs and memory. While the demand for more transistors pushes chip design beyond reticle limits—outside the realm of advanced packaging—the other two trends can be effectively addressed through advanced semiconductor packaging techniques.

Nov 11, 2024 | idtechex.com | Yu-Han Chang

The evolution of telecommunications continues with each decade, and as 5G becomes widespread, attention is shifting to the next generation: 6G. Promising next-level capabilities compared to next generation, 6G will offer data rates reaching terabits per second (Tbps), microsecond-level latency, and ultra-high level of network reliability.

Nov 8, 2024 | idtechex.com | Yu-Han Chang

As semiconductor packaging technologies evolve, advanced methods like 2.5D and 3D Cu-to-Cu hybrid bonding are essential for achieving higher performance and power efficiency. However, manufacturing these technologies to meet high performance and yield standards while fulfilling client requirements is complex. Challenges include developing the right materials and innovating packaging manufacturing techniques.