
Cabe Atwell
Engineering and Technology Writer at Freelance
Technology Editor at Electronic Design
Technology Editor at Electronic Design
Articles
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1 week ago |
electronicdesign.com | Cabe Atwell
What you'll learn: Insight into Fuse Integration's AIRE AI application interface. How AIRE was designed and what features it offers. Fuse Integration launched its AIRE (AI Radio Environment) platform, a next-generation AI application interface designed to boost the performance of Department of Defense IP and tactical networks.
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1 week ago |
electronicdesign.com | Cabe Atwell
What you'll learn: What is the H19 fiber-optic shield? How the platform helps streamline the design process. The custom options offered. OMC's H19 fiber-optic shield has been adapted as a stackable add-on for the Arduino Uno. It's designed to simplify the integration of fiber-optic data links into microprocessor-based platforms.
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1 week ago |
electronicdesign.com | Cabe Atwell
What is the SAMI platform? How the system was trained and utilized. SAMI's potential applications. Eschbach recently unveiled a new AI-powered chat feature for its SAMI (Shiftconnector Artificial Manufacturing Intelligence) enterprise manufacturing platform that's designed to enhance real-time, context-aware decision-making in the manufacturing industry.
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1 week ago |
electronicdesign.com | Cabe Atwell
What you'll learn: How the S32R47 family addresses the requirements of Level 2+ to 4 autonomous driving. How higher resolution sensing enables use cases such as detection of vulnerable road users and lost cargo. Compatibility with other NXP radar products.
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1 week ago |
electronicdesign.com | Cabe Atwell
What you'll learn: Insight into Telit Cinterion's NExT eSIM connectivity solution. How the platform differs from dual-SIM systems. Telit Cinterion's NExT eSIM multi-profile solution is a next-gen technology designed to deliver always-on global cellular connectivity for mission-critical IoT applications. The platform relies on the latest GSMA SGP.22 and SGP.32 eSIM standards, combining multiple redundant connectivity profiles (NExT eProfiles) into a single SIM.
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