
Debao Dai
Articles
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Nov 20, 2024 |
mdpi.com | Yunqing Zhao |Debao Dai |Wei Shao
All articles published by MDPI are made immediately available worldwide under an open access license. No special permission is required to reuse all or part of the article published by MDPI, including figures and tables. For articles published under an open access Creative Common CC BY license, any part of the article may be reused without permission provided that the original article is clearly cited. For more information, please refer to https://www.mdpi.com/openaccess.
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Aug 27, 2024 |
mdpi.com | Wei Shao |Debao Dai |Yunqing Zhao
All articles published by MDPI are made immediately available worldwide under an open access license. No special permission is required to reuse all or part of the article published by MDPI, including figures and tables. For articles published under an open access Creative Common CC BY license, any part of the article may be reused without permission provided that the original article is clearly cited. For more information, please refer to https://www.mdpi.com/openaccess.
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Feb 17, 2024 |
mdpi.com | Min Zhao |Qing Chen |Debao Dai |Yaodong Fan
All articles published by MDPI are made immediately available worldwide under an open access license. No specialpermission is required to reuse all or part of the article published by MDPI, including figures and tables. Forarticles published under an open access Creative Common CC BY license, any part of the article may be reused withoutpermission provided that the original article is clearly cited. For more information, please refer tohttps://www.mdpi.com/openaccess.
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Aug 17, 2023 |
mdpi.com | Debao Dai |Yu Fang |Shihao Wang |Min Zhao
This is an early access version, the complete PDF, HTML, and XML versions will be available soon. Open AccessArticleby 1, 1,*, 2 and 3 1School of Management, Shanghai University, Shanghai 200444, China2Department of Digital Management, Shanghai MAHLE Thermal Systems Co., Ltd., Shanghai 201206, China3SILC Business School, Shanghai University, Shanghai 201800, China*Author to whom correspondence should be addressed.
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