Ed Sperling

Silicon Valley

Editor-in-Chief at Semiconductor Engineering

Editor In Chief of Semiconductor Engineering #semiconductor #semiEDA #AI #embedded #verification #lowpower #test #DataAnalytics #automotive #ICmanufacturing #ML

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Articles

How Secure Are Analog Circuits?

2 days ago | chiplet-marketplace.com | Ed Sperling

Multi-die assemblies enable more analog content, but that adds new security vulnerabilities for which there is little available research. By Ed Sperling, Semi Engineering | June 5, 2025The move toward multi-die assemblies and the increasing value of sensor data at the edge are beginning to focus attention and raise questions about security in analog circuits. In most SoC designs today, security is almost entirely a digital concern.
How Secure Are Analog Circuits?

2 days ago | semiengineering.com | Ed Sperling

The move toward multi-die assemblies and the increasing value of sensor data at the edge are beginning to focus attention and raise questions about security in analog circuits. In most SoC designs today, security is almost entirely a digital concern. Security requirements in digital circuits are well understood, particularly in large data centers and at the upper end of edge computing, which are dominated by digital computing.
Executive Outlook: Chiplets, 3D-ICs, and AI

1 week ago | chiplet-marketplace.com | Ed Sperling

Trouble spots, and some solutions, for the next wave of high-performance semiconductors.
Executive Outlook: Chiplets, 3D-ICs, and AI

1 week ago | semiengineering.com | Ed Sperling

Semiconductor Engineering sat down to discuss chiplets and the challenges of moving to 3D-ICs with Bill Mullen, Ansys fellow; John Ferguson, senior director of product management at Siemens EDA; Chris Mueth, senior director of new markets and strategic initiatives at Keysight; Albert Zeng, senior engineering group director at Cadence; Anand Thiruvengadam, senior director and head of AI product management at Synopsys.
Optical Interconnectivity At 224 Gbps

1 week ago | semiengineering.com | Ed Sperling

Home > Systems & Design > Optical Interconnectivity At 224 Gbps Pros and cons of replacing copper with optical in data-intensive AI systems.
Problems In Testing AI Chips

2 weeks ago | semiengineering.com | Ed Sperling

Home > Test, Measurement & Analytics > Problems In Testing AI Chips Reliability depends on consistency in contacts and clean signals. As AI chips get larger, it becomes much harder to test them.
More Data, More Redundant Interconnects

2 weeks ago | semiengineering.com | Ed Sperling

The proliferation of AI dramatically increases the amount of data that needs to be processed, stored, and moved, accelerating the aging of signal paths through which that data travels and forcing chipmakers to build more redundancy into the interconnects. In the past, nearly all redundant data paths were contained within a planar chip using a relatively thick silicon substrate. But as chipmakers migrate from planar SoCs to multi-die assemblies, many of the data paths in a package are external.
More Data, More Redundant Interconnects

2 weeks ago | chiplet-marketplace.com | Ed Sperling

Circuits are being pushed harder and longer, particularly with AI, speeding up the aging of data paths. Photonics adds its own complications. By Ed Sperling, Semi Engineering | May 19th, 2025 In the past, nearly all redundant data paths were contained within a planar chip using a relatively thick silicon substrate. But as chipmakers migrate from planar SoCs to multi-die assemblies, many of the data paths in a package are external.
Speeding Up Die-To-Die Interconnectivity

3 weeks ago | semiengineering.com | Ed Sperling

Home > Systems & Design > Speeding Up Die-To-Die Interconnectivity Just adding more or thicker wires to a design isn’t sufficient with chiplets. Disaggregating SoCs, coupled with the need to process more data faster, is forcing engineering teams to rethink the electronic plumbing in a system.
Conversing With Your Dishwasher

3 weeks ago | semiengineering.com | Ed Sperling

Home > Auto, Security & Pervasive Computing > Conversing With Your Dishwasher How on-device AI can improve interactions with machines. What does error 22 mean on your “smart” appliance? Today, most people have to look it up on the internet, but that’s about to change.