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Ed Sperling

Silicon Valley

Editor-in-Chief at Semiconductor Engineering

Editor In Chief of Semiconductor Engineering #semiconductor #semiEDA #AI #embedded #verification #lowpower #test #DataAnalytics #automotive #ICmanufacturing #ML

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Articles

  • Can You Build A Known-Good Multi-Die System?

    1 week ago | chiplet-marketplace.com | Ed Sperling

    Executive Outlook: Just because the various components in an advanced package work individually and separately doesn’t mean they will work post-assembly.

  • Can You Build A Known-Good Multi-Die System?

    1 week ago | semiengineering.com | Ed Sperling

    Semiconductor Engineering sat down to discuss the challenges of designing and testing multi-die systems, including how to ensure they will work as expected, with Bill Mullen, Ansys fellow; John Ferguson, senior director of product management at Siemens EDA; Chris Mueth, senior director of new markets and strategic initiatives at Keysight; Albert Zeng, senior engineering group director at Cadence; Anand Thiruvengadam, senior director and head of AI product management at Synopsys.

  • Baya Systems: Moving Data Faster

    1 week ago | semiengineering.com | Ed Sperling |Emma Riverso

    Moving data is one of the big challenges in the AI world. There is so much data being generated that even moving it back and forth from processors to memories requires a significant amount of power, enormous bandwidth, and frequently causes delays that can bog down performance. Now, with substantially more processing, different types of processors on each system on chip (SoC), and the emerging chiplet paradigm, the problem is growing exponentially.

  • LLMs On The Edge

    1 week ago | semiengineering.com | Ed Sperling

    Home > Low Power-High Performance > LLMs On The Edge What’s needed to utilize advances in AI in small devices. Nearly all the data input for AI so far has been text, but that’s about to change.

  • Big Changes In Medical Electronics

    2 weeks ago | semiengineering.com | Ed Sperling

    Home > Manufacturing, Packaging & Materials > Big Changes In Medical Electronics How in-field devices will change health care, and what’s needed to make it work.

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Ed Sperling
Ed Sperling @Chip_Insider
23 Jun 25

Special Report: EDA’s Top Execs Map Out An AI-Driven Future AI is accelerating the need for 3D-ICs and digital twins, and causing lots of disruption along the way. https://t.co/7UDRnXu0qH https://t.co/UsyzCnLBNF

Ed Sperling
Ed Sperling @Chip_Insider
22 Jun 25

Chip Industry Week in Review $60B fabs; Chinese automakers tout 100% homemade chips; 2nm custom SRAM; Cadence’s buy; multi-chiplet NoC; HBM roadmap; MIT’s GaN fab technique; 30% tax credit; Taiwan export restrictions, power vulnerability.. https://t.co/EWCVtyhdkv #technology

Ed Sperling
Ed Sperling @Chip_Insider
21 Jun 25

Power Delivery Challenges For AI Chips Rising power densities and new architectures are forcing a rethinking of interconnects, materials, and thermal management. https://t.co/HoopzzO0tE #powerdelivery #semiconductor #AIhardware #AI