Semiconductor Engineering

Semiconductor Engineering was established by a diverse group of chip designers, engineers, journalists, users, industry organizations, and standards groups to offer valuable insights into the intricate processes of semiconductor design, testing, verification, integration, and manufacturing, as well as the market trends that drive these activities. The aim of this platform is to deliver practical, independently created content through focused monthly newsletters, weekly updates, timely news alerts, videos, independent research, and a forum for discussion and inquiry. Although the site is backed by sponsors, the content produced by our team adheres to the highest standards of journalistic integrity and impartiality. All articles are professionally crafted and vetted by independent journalists and engineers who possess extensive industry expertise, with vendor participation limited to offering insights rather than promoting their products. Founded in 2008, Sperling Media Group LLC focuses on providing a transparent flow of unbiased information concerning technology and business matters in specialized yet demanding markets. In an era of increasing complexity, where genuine insights are crucial, the availability of independent information sources is dwindling.

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Conversing With Your Dishwasher

3 days ago | semiengineering.com | Ed Sperling

Home > Auto, Security & Pervasive Computing > Conversing With Your Dishwasher How on-device AI can improve interactions with machines. What does error 22 mean on your “smart” appliance? Today, most people have to look it up on the internet, but that’s about to change.
E-Beam Inspection Proves Essential For Advanced Nodes

1 week ago | semiengineering.com | Gregory Haley

Electron-beam inspection is proving to be indispensable for finding critical defects at sub-5nm dimensions. The challenge now is how to speed up the process to make it economically palatable to fabs. E-beam inspection’s notorious sensitivity-throughput tradeoff has made comprehensive defect coverage with e-beam at these advanced nodes especially problematic.
Who Is Most Likely To Link Financial And Manufacturing Data?

1 week ago | semiengineering.com | Anne Meixner

Experts at the Table: Semiconductor Engineering sat down to discuss which companies have the most to gain from linking financial data with manufacturing data analytics platforms with Dieter Rathei, CEO of DR Yield; Jon Holt, senior director of product management at PDF Solutions, Alex Burlak, vice president of advanced analytics and test at proteanTecs; and Dirk de Vries, technical program manager and senior architect at Synopsys. What follows are excerpts of that conversation.
Radiation, Temperature, Power Challenges For Chips In Space

1 week ago | semiengineering.com | Liz Allan

Mission-critical hardware used in space is not supposed to fail at all, because lives may be lost in addition to resources, availability, performance, and budgets. For space applications, failure can occur due to a range of factors, including the weather on the day of launch, human error, environmental conditions, unexpected or unknown hazards and degradation of parts to chemical factors, aging, and radiation.
Blog Review: May 7

1 week ago | semiengineering.com | Jesse Allen

Cadence’s Mayank Bhatnagar examines the challenge of ensuring the functional safety of disaggregated designs and how UCIe can serve as a certified way to connect individual components. Siemens’ Charlie Olson explores the causes of inter-domain leakage when a DC path is formed between two power rails and how to overcome the limitations of traditional electrical rule checking.
Research Bits: May 6

1 week ago | semiengineering.com | Jesse Allen

Destroying hydrogen peroxide and triazoleResearchers from the University of Technology Sydney and startup Infinite Water International developed catalytic technology that breaks down hydrogen peroxide and triazole, two chemicals used in semiconductor manufacturing for surface cleaning and corrosion prevention. The goal is to create a cleaner wastewater stream that can be reused within the fab. “We use a catalytic process.
Three-Way Race To 3D-ICs

1 week ago | semiengineering.com | Ed Sperling

Intel Foundry, TSMC, and Samsung Foundry are scrambling to deliver all the foundational components of full 3D-ICs, which collectively will deliver orders of magnitude improvements in performance with minimal power sometime within the next few years. Much attention has been focused on process node advances, but a successful 3D-IC implementation is much more complex and comprehensive than just scaling digital logic.
Smarter Cars, Higher Stakes

2 weeks ago | semiengineering.com | Sascha Brodsky

Artificial intelligence is turbocharging automotive innovation, but it’s also unleashing a tangle of high stakes risks that engineers and security experts are scrambling to contain. The push to embed AI deep into today’s vehicles is changing how cars are built, how they handle the road, and how they keep passengers safe. But as onboard intelligence expands, so do the risks.
Extra Safety Measures Needed For Aerospace ICs

2 weeks ago | semiengineering.com | Liz Allan

Aerospace safety requirements and standards vary depending on whether a spacecraft is manned or unmanned, and how crucial the mission is. The defense contractors designing these spacecraft take various approaches to functional safety based on how critical a component is for the mission to succeed. While losing a few images during an Earth-bound observation may not matter, losing a satellite can be a major setback. And absolutely nobody wants to lose a jet or a rocket.
Cyber Threats Multiply With Commercial Chiplets

2 weeks ago | semiengineering.com | Ann Steffora Mutschler

The commercialization of chiplets will significantly boost the potential for attacks on hardware, requiring a much broader set of security measures and processes at every level of the supply chain, including traceability from initial design to end of life. Much progress has been made in recent years on security measures, including everything from identifying unusual data traffic inside a chip to complex obfuscation techniques.