James Morra
Reporter at Electronic Design
Senior Staff Editor at Endeavor Business Media
Reporter covering semiconductors for Electronic Design. Send tips to [email protected].
Articles
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1 week ago |
electronicdesign.com | James Morra
The AI boom is driving up the power demands of CPUs, GPUs, and other high-performance SoCs in data centers-and they show no signs of slowing down. Today, the most advanced AI chips are bordered on virtually all sides by voltage regulators to convey the current over the last inch of the power-delivery network (PDN) into the point-of-load (POL).
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1 week ago |
electronicdesign.com | James Morra
Marvell said these improvements reduce thermal issues and system-level cooling costs, which are becoming a more significant technical challenge given that these modules need to fit into a similar form factor as a USB stick. Ara is designed to drive 800-Gb/s and 1.6-Tb/s ports on the front or "faceplate" of networking switches using standard PCB trace lengths, without requiring special arrangements for cooling or PCB redesigns to preserve signal integrity.
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1 week ago |
electronicdesign.com | James Morra
In today's semiconductor landscape, scale is becoming a bigger battleground-not only for chipmakers, but increasingly for hyperscalers, cloud giants, and other systems companies, too. They're all racing to roll out a new class of ultra-large systems-on-chips (SoCs), cramming tens of billions of transistors and incorporating a wide range of IP blocks to handle computationally heavy workloads, such as AI training and inferencing.
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1 week ago |
electronicdesign.com | James Morra
Telit Cinterion introduced an industrial-grade software platform that helps manufacturers connect machines, gather data from devices on the factory floor, and feed it all into AI systems without needing to write complex code. According to Telit, the deviceWISE AI platform is built to bridge the gap between operations and IT systems.
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2 weeks ago |
electronicdesign.com | James Morra
The wireless SoC can support up to tri-band 1×1 Wi-Fi over 2.4, 5, and 6 GHz with a power-optimized architecture. It delivers reliable connectivity of up to 50 Mb/s while extending battery life and maximizing range. The SoC also comes with the latest Bluetooth features, such as channel sounding for measuring distance and LE Audio, including Auracast, for delivering wireless audio. Wireless networking support based on 802.15.4 includes the Thread and Zigbee standards.
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