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4 days ago | 
semiengineering.com | Jesse Allen
In a podcast, Siemens’ Conor Peick, Dale Tutt, and Mike Ellow chat about the implications of the software-defined transition, how it affects semiconductor development, and why it seems to be leading more companies towards developing their own silicon. Cadence’s Vinod Khera shows off a Linux-based audio development platform for prototyping AI audio applications with support for real-time audio processing and low-latency DSP tasks.
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4 days ago | 
semiengineering.com | Jesse Allen
Imaging power electronicsResearchers from the Institute of Science Tokyo, Harvard University, and Hitachi used diamond quantum sensors to analyze the magnetization response of soft magnetic materials used in power electronics.
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1 week ago | 
semiengineering.com | Jesse Allen
Siemens’ Patrick Hope considers how to fully perform post-route signal integrity verification on PCB designs while maintaining the project’s timeline by implementing a progressive verification methodology that enables signal integrity experts to focus on issues that demand their expertise rather than simple errors.
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1 week ago | 
semiengineering.com | Jesse Allen
Tracking ferroelectric domain wallsResearchers from Oak Ridge National Laboratory and National Cheng Kung University developed a technique called scanning oscillator piezoresponse force microscopy to observe how domain walls move in ferroelectric materials under rapidly fluctuating electric fields.
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2 weeks ago | 
semiengineering.com | Jesse Allen
Synopsys’ Frank Malloy listens in on a panel discussing the engineering challenges introduced by multi-die designs, from multi-physics interactions that impact power and thermal integrity to the availability of multi-die packages and industry standards. Siemens’ Bruce Caryl shows how to determine how much a design’s power delivery network is contributing to jitter on the output drivers by using a 3D field solver and time-domain simulation.
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2 weeks ago | 
semiengineering.com | Jesse Allen
Smart t-shirt with sound wavesResearchers at ETH Zurich developed a smart textile that uses acoustic waves passed through glass fibers to measure touch, pressure, and movement. The researchers said that using acoustic waves rather than electronics makes measurements more precise with low power consumption and the textiles lighter, more breathable, and easier to wash. It also uses readily available materials.
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3 weeks ago | 
semiengineering.com | Jesse Allen
Siemens’ Stephen V. Chavez finds that proper PCB high voltage spacing between conductive elements is key to reliability and understanding the principles of clearance (through-air spacing) and creepage (along-surface spacing) is critical. Cadence’s Frank Ferro checks out how the new HBM4 standard boosts bandwidth and addresses key issues in the data center, including the growing size of LLM data sets, reliability, and memory efficiency.
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3 weeks ago | 
semiengineering.com | Jesse Allen
Benchmarking 3D-IC coolingResearchers from Massachusetts Institute of Technology (MIT) and HRL Laboratories developed a specialized chip to test and validate cooling solutions for packaged chip stacks. The chip dissipates extremely high power, generating heat through the silicon layer and in localized hot spots to mimic high-performance logic chips. It then uses diodes to measure temperature changes as cooling is applied to the packaged stack.
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1 month ago | 
semiengineering.com | Jesse Allen
Cadence’s Mayank Bhatnagar examines the challenge of ensuring the functional safety of disaggregated designs and how UCIe can serve as a certified way to connect individual components. Siemens’ Charlie Olson explores the causes of inter-domain leakage when a DC path is formed between two power rails and how to overcome the limitations of traditional electrical rule checking.
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1 month ago | 
semiengineering.com | Jesse Allen
Destroying hydrogen peroxide and triazoleResearchers from the University of Technology Sydney and startup Infinite Water International developed catalytic technology that breaks down hydrogen peroxide and triazole, two chemicals used in semiconductor manufacturing for surface cleaning and corrosion prevention. The goal is to create a cleaner wastewater stream that can be reused within the fab. “We use a catalytic process.
