Jesse Allen

1 week ago | semiengineering.com | Jesse Allen

Cadence’s Mayank Bhatnagar examines the challenge of ensuring the functional safety of disaggregated designs and how UCIe can serve as a certified way to connect individual components. Siemens’ Charlie Olson explores the causes of inter-domain leakage when a DC path is formed between two power rails and how to overcome the limitations of traditional electrical rule checking.

1 week ago | semiengineering.com | Jesse Allen

Destroying hydrogen peroxide and triazoleResearchers from the University of Technology Sydney and startup Infinite Water International developed catalytic technology that breaks down hydrogen peroxide and triazole, two chemicals used in semiconductor manufacturing for surface cleaning and corrosion prevention. The goal is to create a cleaner wastewater stream that can be reused within the fab. “We use a catalytic process.

2 weeks ago | semiengineering.com | Jesse Allen

Cadence’s Sree Parvathy points out how electrothermal analysis can help designers understand how temperature changes affect device behavior, such as mobility, threshold voltage, and saturation to mitigate potential failures due to thermal overstress.

2 weeks ago | semiengineering.com | Jesse Allen

Microchannels for two-phase coolingResearchers from the University of Tokyo propose cooling chips using microchannels built into the chips themselves. The method utilizes microfluidic channels to create a capillary structure through which coolant flows and a manifold distribution layer that controls the distribution of coolant. The structure enabled two-phase cooling through better management of the flow of vapor bubbles after heating.

3 weeks ago | semiengineering.com | Jesse Allen

PIC heterogeneous integrationResearchers from Hewlett Packard Labs, Indian Institutes of Technology Madras, Microsoft Research, and University of Michigan built an AI acceleration platform based on heterogeneously integrated photonic ICs.The PIC combines silicon photonics along with III-V compound semiconductors that functionally integrate lasers and optical amplifiers to reduce optical losses and improve scalability.