
Jiaxuan Zhang
Articles
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Nov 24, 2023 |
mdpi.com | Jie Liu |Zihao Li |Jiaxuan Zhang |Renxiang Guan
All articles published by MDPI are made immediately available worldwide under an open access license. No specialpermission is required to reuse all or part of the article published by MDPI, including figures and tables. Forarticles published under an open access Creative Common CC BY license, any part of the article may be reused withoutpermission provided that the original article is clearly cited. For more information, please refer tohttps://www.mdpi.com/openaccess.
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Nov 20, 2023 |
onlinelibrary.wiley.com | Mengmeng Guan |Jiaxuan Zhang |Haowen Tang |Qi Lu
Piezoelectric response of the ferroelectric/piezoelectric thin films is crucial for actuation of MEMS devices as well as strain-mediated electronic devices. Among many piezoelectric modes, longitudinal and transverse piezo-strain is the most widely used. Various methods have been well-established for quantitative characterization of the longitudinal piezo-strain, such as laser interferometer and piezoelectric force microscopy.
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Nov 20, 2023 |
pericles.pericles-prod.literatumonline.com | Jiaxuan Zhang |Haowen Tang |Qi Lu |Mengmeng Guan
Piezoelectric response of the ferroelectric/piezoelectric thin films is crucial for actuation of MEMS devices as well as strain-mediated electronic devices. Among many piezoelectric modes, longitudinal and transverse piezo-strain is the most widely used. Various methods have been well-established for quantitative characterization of the longitudinal piezo-strain, such as laser interferometer and piezoelectric force microscopy.
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Oct 29, 2023 |
mdpi.com | Jinyuan Zhang |Yan Feng |Jiaxuan Zhang |Yijun Li
This is an early access version, the complete PDF, HTML, and XML versions will be available soon. Open AccessArticleby 1,2, 1,2,*, 1 and 1 1Institute of Space Weather, School of Atmospheric Physics, Nanjing University of Information Science & Technology, Nanjing 210044, China2State Key Laboratory of Space Weather, Chinese Academy of Sciences, Beijing 100190, China*Author to whom correspondence should be addressed. Appl. Sci.
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