Packaging IFTLE

1 month ago | 3dincites.com | Packaging IFTLE |Phil Garrou

TSMC Invests Further in ArizonaTaiwan Semiconductor Manufacturing Corporation (TSMC) plans to make a $100B investment in the United States that involves building five additional chip facilities there in coming years. TSMC said the expansion plans included three new chip fabrication plants, two advanced packaging facilities and a major research and development center. So, there it is IFTLE readers, TSMC committing to building advanced packaging capability in the US.

1 month ago | 3dincites.com | Packaging IFTLE |Phil Garrou

ASE has announced that the company plans to establish Taiwan’s first large-scale 600×600 fan-out panel-level packaging (FOPLP) production line in Kaohsiung. With an investment of US$200MM ASE, plans to install equipment in the second quarter 2025 and begin trial runs in the third quarter. The company will assess yield rates and quality by year-end to determine commercial viability.

2 months ago | 3dincites.com | Packaging IFTLE |Phil Garrou

When I was first asked why I had not yet covered the “US Joint Consortium” I responded “tongue in cheek” that I would leave that for Cheech and Chong. However, with the recent announcement of 3M joining the consortium and my subsequent understanding of the involvement of my old friend, Hidenori Abe of Resonac, and other major Japanese players like Namics, TOK and Toppan, IFTLE decided that a closer look was indeed warranted.

2 months ago | 3dincites.com | Packaging IFTLE |Phil Garrou

Commercial Times reports that TSMC’s Arizona wafer fab, Fab 21 Phase 1, has officially entered mass production on its 4nm process. Monthly capacity is expected to reach 30,000 wafers by mid-year. Construction of Fab 21 Phase 2 and Phase 3 are set to proceed this year and next, with fab completion slated for 2025 and 2027, respectively. These expansions will gradually introduce the nanosheet transistor structure for TSMC’s 2nm process.

2 months ago | 3dincites.com | Packaging IFTLE |Phil Garrou

Micross, a portfolio company of Behrman Capital, announced on January 15, that it has acquired Integra Technologies, headquartered in Wichita, KS. Since both are privately owned, the exact amount that Micross paid to acquire Integra Technologies hasn’t been publicly disclosed in the available sources. Micross Components makes microelectronic components for aerospace & defense, space, medical, industrial & commercial applications.