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1 week ago | 
3dincites.com | Phil Garrou
Earlier this year GlobalFoundries (GF) announced a New York Advanced Packaging and Photonics Center (NY APPC) billed as “…the first of-its-kind center to offer advanced packaging and test capabilities in New York for U.S.-made essential chips used in AI, automotive, aerospace and defense, and other applications” at their Fab 8 site in Malta NY (Above image: GF Fab 8 Malta, courtesy of GlobalFoundries) They noted that advanced packaging has emerged as a critical enabler for highly...
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2 weeks ago | 
3dincites.com | Phil Garrou
Dr. Cliff Hou, Senior Vice President and Deputy Co-COO (above), spoke at this year’s 2025 Technology Symposium. highlighting TSMC’s continued advancements in manufacturing technology and global capacity expansion, including updates on new facilities in the United States, Germany, and Japan.
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3 weeks ago | 
3dincites.com | Stefan Paul |Phil Garrou |Dean Freeman |Paul Werbaneth
What is Agentic AI and What Role Can it Play in (Semiconductor) Logistics? Editor’s note: Stefan Paul, CEO of Kuehne+Nagel attended the 2025 World Economic Forum in Davos in January with a focus...
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3 weeks ago | 
3dincites.com | Phil Garrou
In IFTLE 626 we looked at the Yole article that addressed the question of whether panel level processing was finally coming on line. In this blog we will take a look at some of the work Amkor is doing on what they are calling hybrid panel level technology. But before we do, I just wanted to remind the younger generation readership out there that this is not a new concept.
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1 month ago | 
3dincites.com | Phil Garrou |Dean Freeman |Paul Werbaneth |Julia Freer
About SchmidSCHMID Group is enabling advanced packaging through scalable innovation. With over 160 years of engineering excellence, SCHMID Group is a trusted technology partner for high-performance manufacturing solutions in electronics, photovoltaics, glass, and advanced semiconductor packaging.
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1 month ago | 
3dincites.com | Phil Garrou
Is TSMC Acquiring 20% of Intel fabs? Reports are that Intel and TSMC have reached a preliminary agreement to form a joint venture that will operate Intel’s manufacturing facilities. TSMC will hold a 20% stake in the new company. The news comes from Reuters, which cites a report from “The Information” based on “…two sources familiar with the matter”. Intel has not yet commented on the matter. TSMC declined to comment. At present it is unknown which companies will own the remaining 80% of the venture.
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1 month ago | 
3dincites.com | Phil Garrou
An aerial view from February 2024 shows construction progress at Intel’s Ohio One campus of nearly 1,000 acres in Licking County, Ohio. Intel announced plans in January 2022, to invest more than $20 billion in the construction of two new leading-edge chip factories in Ohio. The company broke ground in September 2022. The investment will serve the needs of Intel Foundry customers as part of the company’s IDM 2.0 strategy.
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1 month ago | 
3dincites.com | Phil Garrou |Dean Freeman |Paul Werbaneth |Julia Freer
About LAB14Technological progress is built on precision. True innovation, however, does not happen in isolation. It thrives when expertise, technologies and visions come together. Building on this principle, the Lab14 Group unites leading companies in advanced manufacturing solutions for nano- and microtechnology.
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2 months ago | 
3dincites.com | Phil Garrou
TSMC widens edge over SamsungThe Taipai Times recently offered the following interesting discussion concerning the TSMC versus Samsung rivalry:“As US semiconductor giant Intel Corp.
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2 months ago | 
3dincites.com | Packaging IFTLE |Phil Garrou
TSMC Invests Further in ArizonaTaiwan Semiconductor Manufacturing Corporation (TSMC) plans to make a $100B investment in the United States that involves building five additional chip facilities there in coming years. TSMC said the expansion plans included three new chip fabrication plants, two advanced packaging facilities and a major research and development center. So, there it is IFTLE readers, TSMC committing to building advanced packaging capability in the US.
