Ran Gao

Jun 15, 2023 | mdpi.com | Wenchao Tian |Ran Gao |Lin Gu |Haoyue Ji

Abstract:To meet the demands for miniaturization and multi-functional and high-performance electronics applications, the semiconductor industry has shifted its packaging approach to multi-chip vertical stacking. Among the advanced packaging technologies for high-density interconnects, the most persistent factor affecting their reliability is the electromigration (EM) problem on the micro-bump.