Wenchao Tian

Jan 19, 2025 | onlinelibrary.wiley.com | Xiao Qiang Liu |Engineering Xi'an |Yuyin Wang |Wenchao Tian

Conflict of Interest The authors declare no conflict of interest. Supporting Information Filename Description smll202409801-sup-0001-SuppMat.pdf3.4 MB Supporting Information References 1a) , , , , , J. Am. Chem. Soc. 2020, 142, 9567; b) , , , , , , , Nat. Rev. Methods Primers 2023, 3, 61; c) , , , Nat. Catal. 2020, 3, 775; d) , , , , , , , , , , , , , , , , Nat. Commun. 2022, 13, 7205. 2a) , , , , , , , , , , , , , , , Nature 2021, 586, 549; b) , , , , , , , Adv. Funct. Mater.

Nov 29, 2023 | mdpi.com | Wenchao Tian |Shuaiqi Zhang |Wenbin Li |Yuanming Chen

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Nov 20, 2023 | mdpi.com | Wenchao Tian |Wenbin Li |Shuaiqi Zhang |liming Zhou

All articles published by MDPI are made immediately available worldwide under an open access license. No specialpermission is required to reuse all or part of the article published by MDPI, including figures and tables. Forarticles published under an open access Creative Common CC BY license, any part of the article may be reused withoutpermission provided that the original article is clearly cited. For more information, please refer tohttps://www.mdpi.com/openaccess.

Jun 15, 2023 | mdpi.com | Wenchao Tian |Ran Gao |Lin Gu |Haoyue Ji

Abstract:To meet the demands for miniaturization and multi-functional and high-performance electronics applications, the semiconductor industry has shifted its packaging approach to multi-chip vertical stacking. Among the advanced packaging technologies for high-density interconnects, the most persistent factor affecting their reliability is the electromigration (EM) problem on the micro-bump.

Feb 21, 2023 | mdpi.com | Hao Cui |Wenchao Tian |Yiming Zhang |Zhiqiang Chen

Open AccessArticlebyHao Cui *, Wenchao Tian, Yiming Zhang and Zhiqiang Chen School of Electro-Mechanical Engineering, Xidian University, Xi’an 710000, China*Author to whom correspondence should be addressed.