Thomas D. Prevish

Jun 14, 2024 | plantengineering.com | Adam Zewe |David Nutt |Jack Loughney |Thomas D. Prevish |Chris Vavra

Semiconductor insightsResearchers discovered that gallium nitride devices with ohmic contacts can withstand 500 °C for 48 hours without significant degradation, a crucial step for Venus exploration technology. Gallium nitride’s stability at extreme temperatures suggests it could revolutionize high-temperature electronics, benefiting not only space missions but also geothermal energy extraction and jet engine monitoring.

May 21, 2024 | plantengineering.com | David Nutt |Jack Loughney |Thomas D. Prevish |Chris Vavra

Microchips drive so many essential electronics, from appliances to airplanes, it is easy to take them for granted. But they are not easy to make. For the past two years, a unique project team has enabled Cornell undergraduates to use emerging open-source hardware to design, test and fabricate their own microchips – a complex and expensive process that is rarely, if ever, available to students. Undergrads aren’t the only ones to benefit.

May 17, 2024 | plantengineering.com | David Nutt |Jack Loughney |Thomas D. Prevish |Chris Vavra

The global semiconductor manufacturing industry in the first quarter of 2024 showed improvement with increased installed wafer fab capacity. The globalsemiconductor manufacturing industry in the first quarter of 2024 showed signs of improvement with an uptick in electronic sales, stabilizing inventories and an increase in installed wafer fab capacity, SEMI announced in its Q1 2024 publication of the Semiconductor Manufacturing Monitor (SMM) Report, prepared in partnership with TechInsights.

Feb 20, 2024 | plantengineering.com | David Nutt |Jack Loughney |Thomas D. Prevish |Chris Vavra

Semiconductor insights Researchers at Cornell Engineering discovered two distinct spin-coupled defects in the semiconductor gallium nitride, offering potential for efficient quantum applications at room temperature. Unlike diamond, gallium nitride is a mature semiconductor commonly used in electronics. The identified defects exhibit a significant 30% fluorescence change, a promising feature for quick and efficient quantum measurements.

Jan 12, 2024 | plantengineering.com | Yu-Han Chang |Jack Loughney |Thomas D. Prevish |Steve Kuhlmann |Chris Vavra

Semiconductor insights Semiconductor packaging has evolved from 1D PCB levels to 3D hybrid bonding, enabling micron-level interconnects, achieving 1000 GB/s bandwidth efficiently. Advanced packaging balances power, performance, area, and cost; Si, organic, and glass-based 2.5D tech face trade-offs in scalability, cost, and ecosystem maturity. Semiconductor packaging technologies have evolved from initial 1D PCB levels to the cutting-edge 3D hybrid bonding packaging at the wafer level.