X. Wang

Nov 21, 2024 | sciencedirect.com | X. Wang

The physical models that investigate light transmission within biological tissues serve as the prerequisites and fundamental building blocks for optical non-invasive detection and treatment methods [1]. The diffuse reflection exhibited on the surface of these tissues is intricately linked to their optical properties, enabling us to deduce these properties by analyzing the distribution of light on their surfaces.

Oct 30, 2024 | sciencedirect.com | X. Wang

Interferon-gamma (IFN-γ) can downregulate the expression of solute carrier family 3, member 2 (SLC3A2) and solute carrier family 7, member 11 (SLC7A11), which are subunits of the glutamate-cystine reverse transporter system xc-, impair the intracellular uptake of cystine, and induce ferroptosis [1], [2], [3], [4].

Oct 3, 2024 | nature.com | X. Wang

AbstractWeather conditions and agronomical factors are known to affect Fusarium spp. growth and ultimately deoxynivalenol (DON) contamination in oat. This study aimed to develop predictive models for the contamination of spring oat at harvest with DON on a regional basis in Sweden using machine-learning algorithms. Three models were developed as regional risk-assessment tools for farmers, crop collectors, and food safety inspectors, respectively.

Jul 25, 2024 | link.aps.org | Xin Hu |X. Wang |Zhenyu Wang

We theoretically investigated the antivortex stabilized by anisotropic Dzyaloshinskii-Moriya interaction (DMI) in nanodisks. Remarkably, we found that the antivortex remains stable even when the nanodisk radius is reduced to 15 nm. We also investigated the antivortex dynamics under a static in-plane magnetic field, which shows that the displacement of the antivortex core depends on its vorticity and helicity, providing a fundamental basis for distinguishing different vortex types.

Feb 10, 2024 | sciencedirect.com | X. Wang

In the field of integrated circuit (IC) manufacturing, microelectronics packaging plays a critical role and exerts significant influence on the cost, performance, and reliability of IC products [1], [2]. Packaging accounts for 40 % of the manufacturing cost of IC, and over 25 % of failures can be attributed to packaging issues.