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Apr 11, 2024 | 
newsitem.com | Mosaic Microsystems
ROCHESTER, N.Y. , April 11, 2024 /PRNewswire/ -- Mosaic Microsystems, a leader in the field of microelectronic glass packaging solutions using glass substrate, announced today the addition of Andrew Garland to its engineering team as a process engineer. With a rich background in image sensor package design and assembly engineering, Andrew brings a wealth of experience and a proven track record of driving technological advancements, process improvement, and leadership to Mosaic Microsystems.
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Apr 11, 2024 | 
caledonianrecord.com | Mosaic Microsystems
ROCHESTER, N.Y. , April 11, 2024 /PRNewswire/ -- Mosaic Microsystems, a leader in the field of microelectronic glass packaging solutions using glass substrate, announced today the addition of Andrew Garland to its engineering team as a process engineer. With a rich background in image sensor package design and assembly engineering, Andrew brings a wealth of experience and a proven track record of driving technological advancements, process improvement, and leadership to Mosaic Microsystems.
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Apr 11, 2024 | 
morning-times.com | Mosaic Microsystems
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Apr 11, 2024 | 
thepostandmail.com | Mosaic Microsystems
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Apr 11, 2024 | 
citizensvoice.com | Mosaic Microsystems
, /PRNewswire/ -- Mosaic Microsystems, a leader in the field of microelectronic glass packaging solutions using glass substrate, announced today the addition of Andrew Garland to its engineering team as a process engineer. With a rich background in image sensor package design and assembly engineering, Andrew brings a wealth of experience and a proven track record of driving technological advancements, process improvement, and leadership to Mosaic Microsystems.
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Apr 11, 2024 | 
wtnh.com | Mosaic Microsystems
, /PRNewswire/ -- Mosaic Microsystems, a leader in the field of microelectronic glass packaging solutions using glass substrate, announced today the addition of Andrew Garland to its engineering team as a process engineer. With a rich background in image sensor package design and assembly engineering, Andrew brings a wealth of experience and a proven track record of driving technological advancements, process improvement, and leadership to Mosaic Microsystems.
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Apr 11, 2024 | 
wgntv.com | Mosaic Microsystems
ROCHESTER, N.Y., April 11, 2024 /PRNewswire/ -- Mosaic Microsystems, a leader in the field of microelectronic glass packaging solutions using glass substrate, announced today the addition of Andrew Garland to its engineering team as a process engineer. With a rich background in image sensor package design and assembly engineering, Andrew brings a wealth of experience and a proven track record of driving technological advancements, process improvement, and leadership to Mosaic Microsystems.
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Apr 11, 2024 | 
theohiopressnetwork.com | Mosaic Microsystems
, /PRNewswire/ -- Mosaic Microsystems, a leader in the field of microelectronic glass packaging solutions using glass substrate, announced today the addition of Andrew Garland to its engineering team as a process engineer. With a rich background in image sensor package design and assembly engineering, Andrew brings a wealth of experience and a proven track record of driving technological advancements, process improvement, and leadership to Mosaic Microsystems.
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Nov 29, 2023 | 
3dincites.com | Trine Pierik |Fraunhofer IZM |Mosaic Microsystems
IMAPS held its Arizona Chapter Event at Deca Technologies, which included a presentation from Clifford Sandstrom on: “Achieving High-Density Die-to-Die Integration with Adaptive Pad Stacks on Molded Embedded Bridge Die Interposers,” and a happy hour of networking.
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Nov 2, 2023 | 
3dincites.com | Francoise Von Trapp |Mosaic Microsystems
At the 2023 IMAPS Symposium in October, I had some great community member conversations about some of the hot topics of the day. They shared their opinions on everything from the possibility of the U.S. onshoring advanced packaging technology in high volumes, to the impact of germanium and gallium restrictions on the compound semiconductor development, to the recent announcement by Intel on the introduction of glass core substrates for next-generation advanced packaging, and much more.
