Francoise Von Trapp

Phoenix

Editorial Director at 3D InCites

Host at 3D InCites Podcast

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3dincites.com

Articles

Arizona: The Epicenter of Semiconductor Resurgence

1 week ago | 3dincites.com | Francoise Von Trapp

Whether we start calling it Chip Canyon, the Silicon Zone, or Silicon Diyógí (say Dare-yo-ghee), it looks like Arizona is on track for becoming the epicenter of semiconductor resurgence, not just in the U.S. but in all of North America. And we have the collective visions of Governor Katie Hobbs, Phoenix Mayor Kate Gallego, Sandra Watson, Arizona Commerce Authority, and Chris Camacho, Greater Phoenix Economic Council to thank for it.
Onshoring Advanced Packaging Update

1 month ago | 3dincites.com | Francoise Von Trapp

Rarely a week goes by without Jensen Huang, the CEO of Nvidia, being in the news. In late March, during Nvidia’s GTC developers conference, Huang was in the news daily as he updated the world on how Nvidia was addressing hardware and software needs for AI, as well as starting to look at efforts in quantum computing, which seems to be the next big thing after AI.
Onshoring Advanced Packaging Update

1 month ago | chiplet-marketplace.com | Francoise Von Trapp

By Francoise von Trapp, 3DInCItes | April 08, 2025Rarely a week goes by without Jensen Huang, the CEO of Nvidia, being in the news. In late March, during Nvidia’s GTC developers conference, Huang was in the news daily as he updated the world on how Nvidia was addressing hardware and software needs for AI, as well as starting to look at efforts in quantum computing, which seems to be the next big thing after AI.
New Student Engagement Initiatives at ECTC 2025

1 month ago | 3dincites.com | Francoise Von Trapp

The IEEE Electronic Components and Technology Conference (ECTC), the premier technical conference and product exhibition for the world’s semiconductor packaging industry, has for years organized special events for students. This year, given the urgent need for workforce development in this globally critical industry, the ECTC conference has made student engagement and involvement a major focus.
SEMICON Korea 2025 Member Preview: Lead the Edge

Feb 6, 2025 | 3dincites.com | Francoise Von Trapp

In its continued focus on AI and smart devices, SEMI’s theme for this SEMICON Korea 2025 is “Lead the Edge”. The program focuses on how AI, advanced packaging and sustainable semiconductor manufacturing are “transforming chip design, manufacturing processes and the global supply chain.” As such more than 500 semiconductor companies will welcome 70K attendees to their collective 2301 booths. All of these key areas are sweet spots for 3D InCites member companies, who are leaders in these sectors.
Interconnectology Saves the World!

Jan 8, 2025 | 3dincites.com | Francoise Von Trapp |Fraunhofer IZM |Acm Research |Comet Yxlon

In 2007, when I was managing editor at the now defunct Advanced Packaging Magazine, we went out on a limb in our January Industry Forecast to declare, as our cover story: Advanced Packaging Saves the World! In 2008, we tempered that declaration to Advanced Packaging Drives the Industry! By 2009, we were in the midst of a downturn, and the January Cover Story was titled Weathering the Storm. Halfway into January, the magazine folded.
The 3D InCites Podcast Backtrack – 2024 in Review - 3D InCites

Dec 18, 2024 | 3dincites.com | Francoise Von Trapp

Buzzsprout, the platform where the 3D InCites podcast lives, does a cool thing at the end of the year. It provides the podcast backtrack – a recap of your stats, including the top performing episodes. So we thought we’d share it with you, our listeners and sponsors, to give you an idea of the reach we have. Top 30% of PodcastsAccording to the Buzzsprout Backtrack report, our niche-y little podcast was in the top 50% of all Buzzsprout podcasts! How do they calculate that?
Catching Up on The Latest in Advanced Packaging at SEMICON Europa 2024

Dec 3, 2024 | 3dincites.com | Francoise Von Trapp |MKS Atotech

Now that imec’s Luc Van den hove declared advanced packaging is key to the advancement of semiconductors, everyone in the industry needs to catch up to those who have been following the course of these technologies while they were in development. The Advanced Packaging Conference (APC) at SEMICON Europa 2024 was a good place to do that. And our community members were there to lend a hand. Many presentations offered historical overviews of advanced packaging.
StratEdge Wins Prestigious IMAPS 2024 Corporate Recognition Award

Nov 21, 2024 | 3dincites.com | Francoise Von Trapp

StratEdge Corporation, leader in the design, production, and assembly of high-frequency and high-power semiconductor packages, is proud to announce that it has been awarded the 2024 IMAPS Corporate Recognition Award. The prestigious award was presented on October 1, 2024, during the IMAPS Annual Symposium, recognizing StratEdge’s significant contributions to advancing the microelectronics industry and its longstanding support of the IMAPS organization.
SEMI 20 under 30: Luca Sinkó, SEMILAB R&D Team Leader, Recognized as a 2024 Honoree

Nov 19, 2024 | 3dincites.com | Francoise Von Trapp

We are proud to announce that Luca Sinkó, R&D Team Leader of Semilab SRP Application Team, has been recognized as one of this year’s “SEMI 20 Under 30” honorees!This prestigious program celebrates the brightest young professionals in semiconductor industry, who are making significant contributions in their field of expertise and communities.