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Articles

Artificial Intelligence is Driving Panel Level Packaging

2 months ago | 3dincites.com | Dean Freeman |Fraunhofer IZM |Acm Research

TSMC has announced a roadmap to 9 reticle packages to meet the demand for large scale systems in a package. (A multi-reticle package has more than 800mm2 area of chips in the package.) Nvidia’s Blackwell currently has two chips slightly larger than 800mm2 in the package with eight stacks of HBM, giving each package 193 GB of memory.
Fraunhofer IZM drives chiplet integration for APECS pilot line

Jan 16, 2025 | power-and-beyond.com | Fraunhofer IZM

SEMICONDUCTORS Related Vendors The Fraunhofer Institute for Reliability and Microintegration IZM announces its active contribution to the APECS pilot line launched as part of the EU Chips Acts. APECS intends to promote the development and integration of chiplet technologies as a means of making Europe’s semiconductor industry more competitive.
Interconnectology Saves the World!

Jan 8, 2025 | 3dincites.com | Francoise Von Trapp |Fraunhofer IZM |Acm Research |Comet Yxlon

In 2007, when I was managing editor at the now defunct Advanced Packaging Magazine, we went out on a limb in our January Industry Forecast to declare, as our cover story: Advanced Packaging Saves the World! In 2008, we tempered that declaration to Advanced Packaging Drives the Industry! By 2009, we were in the midst of a downturn, and the January Cover Story was titled Weathering the Storm. Halfway into January, the magazine folded.
Paving the way for the semiconductor future: The Chiplet Center of Excellence commences operations

Aug 12, 2024 | power-and-beyond.com | Fraunhofer IZM

Newsletter Whitepaper Webinars by Products & Applications Latest Articles in "Products & Applications" Industry News Latest Articles in "Industry News" Research & Development Latest Articles in "Research & Development" Tools & Software Latest Articles in "Tools & Software" Experts Services more... SEMICONDUCTORS Related Vendors Three Fraunhofer Institutes have launched a forward-looking research initiative in Dresden: the Chiplet Center of Excellence (CCoE). Its purpose is to partner with...
Fraunhofer IZM Joins Forces with Rapidus for High-End Performance Packaging

May 8, 2024 | 3dincites.com | Fraunhofer IZM

Fraunhofer IZM, a world-leading research institute for advanced microelectronic packaging, and Rapidus Corporation, Japan‘s high-end microelectronics manufacturer founded in 2022, join forces for advanced packaging solutions for 2nm node high-performance computing modules. Rapidus is building a fab on the island of Hokkaido to manufacture 2nm node microchips and the related high-end performance package.
Fraunhofer IZM Manages to Automate Measuring Optical In-glass Waveguides

Dec 18, 2023 | 3dincites.com | Fraunhofer IZM

December 12, 2023The use of glass as substrate in electronics manufacturing enables the additional transmission of optical signals through the substrate material. This allows much higher rates of data transmission, which is vital for many scenarios like automotive, telecommunication, or AI applications.
Member Monthly Highlights - November

Nov 29, 2023 | 3dincites.com | Trine Pierik |Fraunhofer IZM |Mosaic Microsystems

IMAPS held its Arizona Chapter Event at Deca Technologies, which included a presentation from Clifford Sandstrom on: “Achieving High-Density Die-to-Die Integration with Adaptive Pad Stacks on Molded Embedded Bridge Die Interposers,” and a happy hour of networking.
Community Member Monthly News – October - 3D InCites

Nov 1, 2023 | 3dincites.com | Trine Pierik |Fraunhofer IZM

October flew by and our community members were busy…Deca was the recipient of the prestigious IMAPS Corporate Recognition Award in San Diego for its significant technical contributions to the microelectronics industry. Robin Davis, Sr. Director of Business Development at Deca, was also recognized with the impressive IMAPS Emerging Leadership award. Onto Innovation hosted the Boston Chapter of the Society of Women Engineers (SWE Boston) at its headquarters in Wilmington, Massachusetts.
ECG with a Patch: APPLAUSE European Collaborative Project Successfully Completed

Oct 18, 2023 | 3dincites.com | Fraunhofer IZM

Researchers from Fraunhofer IZM, together with 31 partners from industry and research, have developed a stretchable and wireless patch that can be used to make it possible to conduct diagnostically relevant cardiac monitoring in every-day life. This will reduce the number of inpatient examinations required for high-risk patients. It also boosts the semiconductor value chain for the medical sector in Europe through the development of new tools, methods and processes for series production.
Packaging, Connecting, and Integrating: 30 years of Fraunhofer IZM - 30 years of packaging and interconnection excellence in microelectronics

Sep 21, 2023 | 3dincites.com | Fraunhofer IZM

The Fraunhofer Institute for Reliability and Microintegration IZM is marking its thirtieth year with a high-profile international conference in September. The Institute that now employs more than 400 people at its three sites was founded by twenty-one German scientists on a mission. Its main site in the historic architectural brickwork masterpiece in Berlin is not just a place with lots of history.