3D InCites

3D InCites was established in 2009 by Francoise von Trapp with the aim of offering a different perspective on information that emphasizes engagement and collaboration. The organization seeks to generate excitement around 3D IC integration and 3D packaging technologies. For successful 3D integration to take place, it is essential to foster collaboration throughout the supply chain. As a result, 3D InCites works to connect important stakeholders to help promote the adoption of 2.5D and 3D technologies in the market.

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ECTC 2025 Celebrates Seventy-five Years of Pushing the Connectivity Scale

5 days ago | 3dincites.com | Francoise Von Trapp

Seventy-five years is a long time. Fireworks often light up the sky to celebrate such significant milestones. How fitting it was, then, for the 75th Anniversary Celebration of the IEEE Electronics Component Technology Conference (ECTC 2025) to replace those fireworks with a drone show.
New York Advanced Packaging and Photonics Center

1 week ago | 3dincites.com | Phil Garrou

Earlier this year GlobalFoundries (GF) announced a New York Advanced Packaging and Photonics Center (NY APPC) billed as “…the first of-its-kind center to offer advanced packaging and test capabilities in New York for U.S.-made essential chips used in AI, automotive, aerospace and defense, and other applications” at their Fab 8 site in Malta NY (Above image: GF Fab 8 Malta, courtesy of GlobalFoundries) They noted that advanced packaging has emerged as a critical enabler for highly...
TSMC System-on-Wafer; Intel Layoff Updates- 3D InCites

2 weeks ago | 3dincites.com | Phil Garrou

Dr. Cliff Hou, Senior Vice President and Deputy Co-COO (above), spoke at this year’s 2025 Technology Symposium. highlighting TSMC’s continued advancements in manufacturing technology and global capacity expansion, including updates on new facilities in the United States, Germany, and Japan.
Trymax Semiconductor Equipment B.V. Reaches 500 Process Chamber Installations in Asia

3 weeks ago | 3dincites.com | Francoise Von Trapp

Milestone signals strong momentum towards 1,000 global systems by end-2025Nijmegen, The Netherlands, 14 May 2025 — Trymax Semiconductor Equipment (Trymax), a leading provider of plasma- and UV-based solutions for semiconductor manufacturing, announces the installation of its 500th process chamber in Asia.
Stefan Paul, Author at 3D InCites

3 weeks ago | 3dincites.com | Stefan Paul |Phil Garrou |Dean Freeman |Paul Werbaneth

What is Agentic AI and What Role Can it Play in (Semiconductor) Logistics? Editor’s note: Stefan Paul, CEO of Kuehne+Nagel attended the 2025 World Economic Forum in Davos in January with a focus...
IFTLE 627: Amkor Studying Hybrid Panel Level Technology

3 weeks ago | 3dincites.com | Phil Garrou

In IFTLE 626 we looked at the Yole article that addressed the question of whether panel level processing was finally coming on line. In this blog we will take a look at some of the work Amkor is doing on what they are calling hybrid panel level technology. But before we do, I just wanted to remind the younger generation readership out there that this is not a new concept.
TSMC 2025 Technology Symposium: A Commitment to Customers

3 weeks ago | 3dincites.com | Dean Freeman

Nanosheets, Superpower rails, 3D Fabric, SoW, along with N2, N3, 16A, and 14A. Enough acronyms and numbers to make your head spin. All of these terms and more were discussed at the TSMC 2025 North America Technology Symposium in Santa Clara, held in late April. TSMC holds this event annually to update its progress and let its customers and partners know where they are headed over the next few years.
Arizona: The Epicenter of Semiconductor Resurgence

1 month ago | 3dincites.com | Francoise Von Trapp

Whether we start calling it Chip Canyon, the Silicon Zone, or Silicon Diyógí (say Dare-yo-ghee), it looks like Arizona is on track for becoming the epicenter of semiconductor resurgence, not just in the U.S. but in all of North America. And we have the collective visions of Governor Katie Hobbs, Phoenix Mayor Kate Gallego, Sandra Watson, Arizona Commerce Authority, and Chris Camacho, Greater Phoenix Economic Council to thank for it.
Schmid Group, Author at 3D InCites

1 month ago | 3dincites.com | Phil Garrou |Dean Freeman |Paul Werbaneth |Julia Freer

About SchmidSCHMID Group is enabling advanced packaging through scalable innovation. With over 160 years of engineering excellence, SCHMID Group is a trusted technology partner for high-performance manufacturing solutions in electronics, photovoltaics, glass, and advanced semiconductor packaging.
IFTLE 626: Rumors Swirl about Intel and TSMC; Update on Panel Level Processing (PLP)

1 month ago | 3dincites.com | Phil Garrou

Is TSMC Acquiring 20% of Intel fabs? Reports are that Intel and TSMC have reached a preliminary agreement to form a joint venture that will operate Intel’s manufacturing facilities. TSMC will hold a 20% stake in the new company. The news comes from Reuters, which cites a report from “The Information” based on “…two sources familiar with the matter”. Intel has not yet commented on the matter. TSMC declined to comment. At present it is unknown which companies will own the remaining 80% of the venture.