3D InCites

3D InCites was established in 2009 by Francoise von Trapp with the aim of offering a different perspective on information that emphasizes engagement and collaboration. The organization seeks to generate excitement around 3D IC integration and 3D packaging technologies. For successful 3D integration to take place, it is essential to foster collaboration throughout the supply chain. As a result, 3D InCites works to connect important stakeholders to help promote the adoption of 2.5D and 3D technologies in the market.

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Stefan Paul, Author at 3D InCites

3 days ago | 3dincites.com | Stefan Paul |Phil Garrou |Dean Freeman |Paul Werbaneth

What is Agentic AI and What Role Can it Play in (Semiconductor) Logistics? Editor’s note: Stefan Paul, CEO of Kuehne+Nagel attended the 2025 World Economic Forum in Davos in January with a focus...
IFTLE 627: Amkor Studying Hybrid Panel Level Technology

4 days ago | 3dincites.com | Phil Garrou

In IFTLE 626 we looked at the Yole article that addressed the question of whether panel level processing was finally coming on line. In this blog we will take a look at some of the work Amkor is doing on what they are calling hybrid panel level technology. But before we do, I just wanted to remind the younger generation readership out there that this is not a new concept.
TSMC 2025 Technology Symposium: A Commitment to Customers

5 days ago | 3dincites.com | Dean Freeman

Nanosheets, Superpower rails, 3D Fabric, SoW, along with N2, N3, 16A, and 14A. Enough acronyms and numbers to make your head spin. All of these terms and more were discussed at the TSMC 2025 North America Technology Symposium in Santa Clara, held in late April. TSMC holds this event annually to update its progress and let its customers and partners know where they are headed over the next few years.
Arizona: The Epicenter of Semiconductor Resurgence

1 week ago | 3dincites.com | Francoise Von Trapp

Whether we start calling it Chip Canyon, the Silicon Zone, or Silicon Diyógí (say Dare-yo-ghee), it looks like Arizona is on track for becoming the epicenter of semiconductor resurgence, not just in the U.S. but in all of North America. And we have the collective visions of Governor Katie Hobbs, Phoenix Mayor Kate Gallego, Sandra Watson, Arizona Commerce Authority, and Chris Camacho, Greater Phoenix Economic Council to thank for it.
Schmid Group, Author at 3D InCites

2 weeks ago | 3dincites.com | Phil Garrou |Dean Freeman |Paul Werbaneth |Julia Freer

About SchmidSCHMID Group is enabling advanced packaging through scalable innovation. With over 160 years of engineering excellence, SCHMID Group is a trusted technology partner for high-performance manufacturing solutions in electronics, photovoltaics, glass, and advanced semiconductor packaging.
IFTLE 626: Rumors Swirl about Intel and TSMC; Update on Panel Level Processing (PLP)

2 weeks ago | 3dincites.com | Phil Garrou

Is TSMC Acquiring 20% of Intel fabs? Reports are that Intel and TSMC have reached a preliminary agreement to form a joint venture that will operate Intel’s manufacturing facilities. TSMC will hold a 20% stake in the new company. The news comes from Reuters, which cites a report from “The Information” based on “…two sources familiar with the matter”. Intel has not yet commented on the matter. TSMC declined to comment. At present it is unknown which companies will own the remaining 80% of the venture.
IFTLE 625: If Intel Ohio is on Hold – Do They Still Get CHIPS Act Funds? - 3D InCites

3 weeks ago | 3dincites.com | Phil Garrou

An aerial view from February 2024 shows construction progress at Intel’s Ohio One campus of nearly 1,000 acres in Licking County, Ohio. Intel announced plans in January 2022, to invest more than $20 billion in the construction of two new leading-edge chip factories in Ohio. The company broke ground in September 2022. The investment will serve the needs of Intel Foundry customers as part of the company’s IDM 2.0 strategy.
LAB14, Author at 3D InCites

1 month ago | 3dincites.com | Phil Garrou |Dean Freeman |Paul Werbaneth |Julia Freer

About LAB14Technological progress is built on precision. True innovation, however, does not happen in isolation. It thrives when expertise, technologies and visions come together. Building on this principle, the Lab14 Group unites leading companies in advanced manufacturing solutions for nano- and microtechnology.
Onshoring Advanced Packaging Update

1 month ago | 3dincites.com | Francoise Von Trapp

Rarely a week goes by without Jensen Huang, the CEO of Nvidia, being in the news. In late March, during Nvidia’s GTC developers conference, Huang was in the news daily as he updated the world on how Nvidia was addressing hardware and software needs for AI, as well as starting to look at efforts in quantum computing, which seems to be the next big thing after AI.
IFTLE 624: TSMC widens lead on Samsung, Leads in 2nm Chip Production - 3D InCites

1 month ago | 3dincites.com | Phil Garrou

TSMC widens edge over SamsungThe Taipai Times recently offered the following interesting discussion concerning the TSMC versus Samsung rivalry:“As US semiconductor giant Intel Corp.