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3 days ago | 
3dincites.com | Stefan Paul |Phil Garrou |Dean Freeman |Paul Werbaneth
What is Agentic AI and What Role Can it Play in (Semiconductor) Logistics? Editor’s note: Stefan Paul, CEO of Kuehne+Nagel attended the 2025 World Economic Forum in Davos in January with a focus...
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5 days ago | 
3dincites.com | Dean Freeman
Nanosheets, Superpower rails, 3D Fabric, SoW, along with N2, N3, 16A, and 14A. Enough acronyms and numbers to make your head spin. All of these terms and more were discussed at the TSMC 2025 North America Technology Symposium in Santa Clara, held in late April. TSMC holds this event annually to update its progress and let its customers and partners know where they are headed over the next few years.
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2 weeks ago | 
3dincites.com | Phil Garrou |Dean Freeman |Paul Werbaneth |Julia Freer
About SchmidSCHMID Group is enabling advanced packaging through scalable innovation. With over 160 years of engineering excellence, SCHMID Group is a trusted technology partner for high-performance manufacturing solutions in electronics, photovoltaics, glass, and advanced semiconductor packaging.
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1 month ago | 
3dincites.com | Phil Garrou |Dean Freeman |Paul Werbaneth |Julia Freer
About LAB14Technological progress is built on precision. True innovation, however, does not happen in isolation. It thrives when expertise, technologies and visions come together. Building on this principle, the Lab14 Group unites leading companies in advanced manufacturing solutions for nano- and microtechnology.
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2 months ago | 
3dincites.com | Dean Freeman |Fraunhofer IZM |Acm Research
TSMC has announced a roadmap to 9 reticle packages to meet the demand for large scale systems in a package. (A multi-reticle package has more than 800mm2 area of chips in the package.) Nvidia’s Blackwell currently has two chips slightly larger than 800mm2 in the package with eight stacks of HBM, giving each package 193 GB of memory.
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2 months ago | 
3dincites.com | Dean Freeman
Sustainability goals and efforts are starting to hit some headwinds in the world. In the United States the Trump administration has yet again pulled out of the Paris agreement, and has a campaign promise of “Drill baby, drill!”. However, the United States is not alone in the challenges of keeping up with the Paris accord. On February 1, Bloomberg Green reported that 7 of 10 of the world’s largest economies failed to submit an emissions cutting plan report to the United Nations.
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2 months ago | 
3dincites.com | Isabella Drolz |Phil Garrou |Dean Freeman |Paul Werbaneth
Bridging the Semiconductor Talent Gap – The Role of the European Chips Act and BeyondThe European Chips Act (ECA) is pivotal to Europe’s strategy for technological sovereignty, aiming to strengthen the continent’s semiconductor supply...
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Feb 11, 2025 | 
3dincites.com | Dean Freeman
Heterogenous integration and AI are currently moving forward hand-in-hand as the demand for greater computing power in theory, reduces the energy and time needed to train models; (although, DeepSeek may now change some of the thinking along these lines). Larger more complex packages are being built to manage the learning process. Nvidia’s latest AI processor is a 2x reticle, and TSMC discussed its OIP a 9x reticle package using the A16 process and the CoWoS combined with the SoIC technology.
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Jan 27, 2025 | 
3dincites.com | Dean Freeman
When the United States and Europe looked to re-shore semiconductor technology, the primary focus was restoring leading-edge manufacturing and creating more resilient supply chains throughout the ecosystem. Eventually, it emerged that nearly all of the leading-edge advanced packaging took place in Asia, and there was minimal packaging capability in either the US or Europe. This should not come as a surprise to anyone involved in the industry.
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Jan 22, 2025 | 
3dincites.com | Dean Freeman
The semiconductor industry has been discussing breaching the 1 trillion-dollar mark as it was coming out of COVID-19 and amid a boom year in 2022. The slowdown in 2023 had some resetting the dates for when the industry would crest the 1 trillion mark. The AI boom of 2024 has given renewed hope that the trillion-dollar mark could be reached by 2030. At SEMI ISS 2025 this was one of the topics mentioned more than a few times during the two and a half day meeting.
