EE Journal

EEJournal provides exclusive insights from engineers to engineers, which has built a strong and dedicated following among professionals in the engineering field. We deliver our original content to our audience in the way they prefer—whether it’s through web, email, mobile, or social media—ensuring they receive it when and how they want it.

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Wow! AI-Powered “Sketch-on-Napkin” to Embedded Design

2 days ago | eejournal.com | Max Maxfield

I was just thinking about the 1871 book Through the Looking-Glass, and What Alice Found There by mathematician, logician, Anglican deacon, writer, and photographer, the Reverend Charles Lutwidge Dodgson (a.k.a. Lewis Carroll). Lewis Carroll’s Alice’s Adventures in Wonderland and Through the Looking-Glass continue to influence us today, not just as beloved children’s stories but as enduring works that challenge the boundaries of logic, language, and imagination.
Headed to the Skies! High Speed Data Transmission for Aerospace Designs

6 days ago | eejournal.com | Amelia Dalton

This week’s podcast is all about high speed data transmission in aerospace applications! My podcast guests this week are Christian Hobmaier and Thomas Mittermeier from ODU connectors. Christian, Thomas and I explore the biggest challenges in this arena, the innovative new connector solutions ODU offers to support these kinds of designs, and the details of ODU’s rigorous testing that includes a technique called the “Arizona Dust Test”.
Silanna challenges legacy pricing and inventory models with introduction of Plural™ Data Converter Series

1 week ago | eejournal.com | Amelia Dalton

SAN DIEGO, CA: May 7th, 2025Silanna Semiconductor, the home of analog innovation, has announced the launch of Plural™, a new generation of data converters for customers eager to find a more available, affordable, high-performance alternative to existing brands. The company has developed 10, 12, 14, and 16-bit ResolutionPlatforms™, each factory-configurable using Silanna’s proprietary Plural™ architecture.
NOVOSENSE Launches New Automotive Grade Digital Isolator Range for NEVs

1 week ago | eejournal.com | Amelia Dalton

May 7, 2025, Shanghai – NOVOSENSE Microelectronics, a semiconductor company specializing in high-performance analog and mixed-signal chips, has launched a new range of third-generation automotive-grade digital isolators. The NSI83xx series of capacitive-based isolators offer superior EOS resilience and minimal power noise susceptibility, making them ideal for simplified system-level EMI mitigation and ensuring signal integrity in dense, high-frequency SiC-based switching environments.
Cybord’s Visual AI Solution to Be Integrated with Siemens’ Opcenter MES

1 week ago | eejournal.com | Amelia Dalton

Wilmington, Delaware, May 7th, 2025 – Cybord, a leading provider of advanced visual-AI electronic component analytics, and Siemens Digital Industries Software have signed a new OEM agreement to integrate Cybord’s cutting-edge AI technology with Siemens’ Opcenter™ software for Manufacturing Execution Systems (MES). The collaboration expands a previous OEM agreement and enables Siemens to offer Cybord’s powerful AI solutions to Opcenter customers and Siemens’ factories globally.
Vishay Intertechnology Releases AEC-Q100 Qualified Ambient Light Sensor in Rectangular 4.38 mm x 1.45 mm x 0.6 mm Package

1 week ago | eejournal.com | Amelia Dalton

MALVERN, Pa. — May 7, 2025 — Vishay Intertechnology, Inc. (NYSE: VSH) today introduced the industry’s first AEC-Q100 qualified rectangular ambient light sensor. The Vishay Semiconductors VEML4031X00 features an ALS and highly sensitive IR photodiode in an opaque 4.38 mm by 1.45 mm surface-mount package with a low 0.6 mm profile.
Artificial Intelligence (AI) Meets Networks-on-Chip (NoCs) in More Ways Than One

1 week ago | eejournal.com | Max Maxfield

Way back in the mists of time that we used to call 2023, I wrote (well, waffled) a column about Network-on-Chip (NoC) technology (see Who Needs a Network-on-Chip (NoC)? Everyone!). Suffice it to say that this was in the days before the punctuation police forbade me from using exclamation marks in my titles (thankfully, I’m not bitter). Well, even though this was but two short years ago, all I can say is that NoC technology has progressed in leaps and bounds since then.
Is the world ready for Platypus, Zero ASIC’s open-source eFPGA IP? CEO Andreas Olafsson is betting that the answer is “Yes”

1 week ago | eejournal.com | Steven Leibson

Embedded FPGA (eFPGA) IP is not new. Several companies including Achronix, Efinix, Flex Logix, Menta, and QuickLogic have been offering FPGA cores for integration into ASICs and SoCs for a while. ASIC designers use eFPGA cores to help future-proof their designs. The eFPGA can be used to patch bugs or add features as needed. These abilities help to avoid a costly and time-consuming re-spin of the ASIC.
Power Inductor Considerations for AI Computing and High-Powered Processors - Vishay and Mouser

1 week ago | eejournal.com | Amelia Dalton

In this episode of Chalk Talk, Mariyah Sachak from Vishay and Amelia Dalton explore how various inductor solutions can supply near-instant power to demanding loads at low, core-level voltages for high power computing applications. They also investigate the benefits of Trans-Inductor voltage regulators and what you will need to consider when choosing the right inductor solution for your next design.
Peraso Announces Addition of PRM2141X-D Dual-Polarized Module to PERSPECTUS Family

1 week ago | eejournal.com | Amelia Dalton

SAN JOSE, CA / ACCESS Newswire / May 1, 2025 / Peraso Inc. (NASDAQ:PRSO) (“Peraso” or the “Company”), a pioneer in mmWave wireless technology solutions, is pleased to announce the latest addition to the Company’s PERSPECTUS series of mmWave modules, the PRM2141X-D. Built around the Peraso X720 60-GHz chipset, the PRM2141X-D module is designed for the most challenging dynamic and high-mobility deployments.