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ASML targeted in latest round of US tariffs

1 week ago | design-reuse.com | Nick Flaherty

By Nick Flaherty, eeNews Europe (April 16, 2025) European and Japanese suppliers of semiconductor equipment are set to be targeted in the next round of tariffs by the US. The Bureau of Industry and Security at the US Department of Commerce is requesting public comments on a national security investigation on the import of semiconductors and semiconductor manufacturing equipment. Click here to read more ...
Why Do Hyperscalers Design Their Own CPUs?

1 week ago | design-reuse.com | Sally Ward-Foxton

By Sally Ward-Foxton, EETimes (April 10, 2025) SAN JOSE, Calif. – U.S. hyperscalers like AWS, Google and Microsoft have designed their own CPUs for the data center in recent years, investing hundreds of millions of dollars into their own chip designs. All these CPUs are based on Arm. But with other options on the market, what motivates these companies to spend the time and money on building their own silicon?
Silicon Photonics and Co-Packaged Optics Shine a Light at OFC 2025

2 weeks ago | design-reuse.com | Nitin Dahad

By Nitin Dahad, EETimes (April 4, 2025) The 2025 Optical Fiber Communications Conference, or OFC 2025, took place this week in San Francisco, Calif., amid the excitement of optical networking being one part of the solution to solving the many facets of AI compute bottlenecks.
Analysts question TSMC-Intel JV plan

2 weeks ago | design-reuse.com | David Manners

Financial analysts have poured cold water on the proposal for TSMC to run Intel’s fabs in a jv. By David Manners, ElectronicsWeekly (April 7, 2025) “We do not believe TSMC operating/forming a JV with Intel would work given differences in manufacturing and operations,” says Citi, “we also question the wisdom of fabless companies investing in this JV.” It was suggested that Broadcom, Qualcomm and AMD might invest in the JV. Click here to read more ...
Will RISC-V reduce auto MCU's future risk?

2 weeks ago | design-reuse.com | Junko Yoshida

By going RISC-V, suppliers of automotive MCUs based on proprietary processor cores hope to avoid getting designed out by OEMs and excluded from the huge Chinese market. By Junko Yoshida for Yole Group 5April 2, 2025° Automakers are at a crossroads. An open platform is inevitable even among traditionally conservative automakers. OEMs demand flexibility in software choices, hardware architecture and supply chains.
Intel brings 3nm production to Europe in 2025

3 weeks ago | design-reuse.com | Nick Flaherty

By Nick Flaherty, eeNews Europe (March 28, 2025) Intel is shifting high volume production of 3nm chips to Europe at its Fab34 in Ireland later this year. Intel 3 is the company’s second EUV lithography node with an 18% performance-per-watt improvement over Intel 4. The process is offered to foundry customers and was in high-volume manufacturing in Oregon during 2024, with high-volume manufacturing shifted to Leixlip in Ireland for 2025, it said in its annual report.
Qualcomm initiates global anti-trust complaint about Arm

4 weeks ago | design-reuse.com | David Manners

Qualcomm has initiated anti-competitive complaints against Arm in the US, Korea and Europe, reports Bloomberg. By David Manners, ElectronicsWeekly (March 26, 2025) Qualcomm is alleging that after 35 years of running an open licensing operation which is open to all and in which all its licensees are treated equally, Arm is now restricting access to its technology in order to make chips in competition with its licensees. Click here to read more ...
Strategies for Addressing More Complex Custom Chip Design

1 month ago | design-reuse.com | Abhishek Jadhav

By Abhishek Jadhav, EETimes (March 21, 2025) Unprecedented growth and demand for edge computing and high-performance computing (HPC) is creating new opportunities and significant challenges for custom chips. We spoke to Sondrel CEO Oliver Jones to discuss some of the approaches to addressing these needs. Custom chip design is a multifaceted process involving many considerations, from power efficiency and performance trade-offs to manufacturing and packaging complexities.
SoCs Get a Helping Hand from AI Platform FlexGen

1 month ago | design-reuse.com | Gary Hilson

By Gary Hilson, EETimes | March 21, 2025 FlexGen, a network-on-chip (NoC) interconnect IP, is aiming to accelerate SoC creation by leveraging AI. Developed by Arteris Inc., FlexGen promises to deliver a 10× productivity boost while reducing design iterations and the time required to develop.
Intel's New CEO Called "Strong Choice" to Respin Company

1 month ago | design-reuse.com | Alan Patterson

By Alan Patterson, EETimes (March 13, 2025) Intel’s new CEO, Lip-Bu Tan, is a good choice to turn the struggling U.S. chipmaker around, according to analysts who spoke to EE Times. Tan, an industry veteran, is rejoining the Intel board after departing in August 2024, the company said in an announcement yesterday. He succeeds interim Co-CEOs David Zinsner and Michelle Holthaus. Zinsner will keep his position as executive VP and CFO, while Holthaus will remain CEO of Intel Products.