
Comet Yxlon
Articles
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Jan 8, 2025 |
3dincites.com | Francoise Von Trapp |Fraunhofer IZM |Acm Research |Comet Yxlon
In 2007, when I was managing editor at the now defunct Advanced Packaging Magazine, we went out on a limb in our January Industry Forecast to declare, as our cover story: Advanced Packaging Saves the World! In 2008, we tempered that declaration to Advanced Packaging Drives the Industry! By 2009, we were in the midst of a downturn, and the January Cover Story was titled Weathering the Storm. Halfway into January, the magazine folded.
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Dec 16, 2024 |
3dincites.com | Comet Yxlon
Through the next generation of its CA20 X-ray inspection solution, Comet Yxlon answers the semiconductor industry’s call for fast and efficient analyzing of advanced packaging ICs. By combining high-resolution 3D X-ray and automated 3D metrology for CoS (chip-on-substrate) solder connections, the new CA20 enables manufacturers to identify and eliminate systematic yield issues faster than ever before.
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Nov 15, 2023 |
smttoday.com | Comet Yxlon
By leveraging advanced computed laminography and integrated AI technology, Comet Yxlon brings high-resolution 3D X-ray capabilities to the forefront for detailed testing in the advanced packaging of integrated circuits. For the first time, the semiconductor market now has a nondestructive supplement or alternative to conventional destructive methods.
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Jun 14, 2023 |
qualitymag.com | Comet Yxlon
It all starts with the question, "How can we clearly see what is going on inside our product without damaging it?" In certain cases, the answer is an industrial x-ray (2D) or computed tomography (3D) system that can evaluate, analyze, and inspect internal and external features while preserving product integrity. These essential tools supply a wide range of benefits, from first article inspection through quality assurance.
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