Acm Research

2 months ago | 3dincites.com | Dean Freeman |Fraunhofer IZM |Acm Research

TSMC has announced a roadmap to 9 reticle packages to meet the demand for large scale systems in a package. (A multi-reticle package has more than 800mm2 area of chips in the package.) Nvidia’s Blackwell currently has two chips slightly larger than 800mm2 in the package with eight stacks of HBM, giving each package 193 GB of memory.

Jan 14, 2025 | globenewswire.com | Acm Research

—Updates 2024 Revenue Outlook to $755 to $770 Million— —Projected 2025 Revenue of $850 to $950 Million— —ACM to Participate at Upcoming Conferences— FREMONT, Calif., Jan. 14, 2025 (GLOBE NEWSWIRE) --  ACM Research, Inc.

Jan 14, 2025 | bakersfield.com | Acm Research

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Jan 8, 2025 | 3dincites.com | Francoise Von Trapp |Fraunhofer IZM |Acm Research |Comet Yxlon

In 2007, when I was managing editor at the now defunct Advanced Packaging Magazine, we went out on a limb in our January Industry Forecast to declare, as our cover story: Advanced Packaging Saves the World!  In 2008, we tempered that declaration to Advanced Packaging Drives the Industry! By 2009, we were in the midst of a downturn, and the January Cover Story was titled Weathering the Storm. Halfway into January, the magazine folded.

Dec 10, 2024 | bakersfield.com | Acm Research

FREMONT, Calif., Dec. 10, 2024 (GLOBE NEWSWIRE) -- ACM Research, Inc. (“ACM”) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced packaging applications, today announced the qualification of its Ultra Fn A Plasma-Enhanced Atomic Layer Deposition (PEALD) Furnace tool. The tool has achieved process qualification at a mainland China semiconductor customer, and is now entering mass production.