Rahul Pendurthi

Jul 23, 2024 | nature.com | Rahul Pendurthi |Zhiyu Zhang |Aaryan Oberoi |Subir Ghosh |Shalini Kumari |Joan M. Redwing | +3 more

AbstractThe semiconductor industry is transitioning to the ‘More Moore’ era, driven by the adoption of three-dimensional (3D) integration schemes surpassing the limitations of traditional two-dimensional scaling. Although innovative packaging solutions have made 3D integrated circuits (ICs) commercially viable, the inclusion of through-silicon vias and microbumps brings about increased area overhead and introduces parasitic capacitances that limit overall performance.