Joan M. Redwing

Dec 3, 2024 | nature.com | Harikrishnan Ravichandran |Theresia Knobloch |Shiva Subbulakshmi Radhakrishnan |Christoph Wilhelmer |Subir Ghosh |Aaryan Oberoi | +4 more

AbstractWhile defects are undesirable for the reliability of electronic devices, particularly in scaled microelectronics, they have proven beneficial in numerous quantum and energy-harvesting applications. However, their potential for new computational paradigms, such as neuromorphic and brain-inspired computing, remains largely untapped.

Oct 8, 2024 | nature.com | Subir Ghosh |Yikai Zheng |Zhiyu Zhang |Yongwen Sun |Thomas F. Schranghamer |Aaryan Oberoi | +1 more

AbstractMonolithic three-dimensional (M3D) integration is being increasingly adopted by the semiconductor industry as an alternative to traditional through-silicon via technology as a way to increase the density of stacked, heterogenous electronic components. M3D integration can also provide transistor-level partitioning and material heterogeneity. However, there are few large-area demonstrations of M3D integration using non-silicon materials.

Jul 23, 2024 | nature.com | Rahul Pendurthi |Zhiyu Zhang |Aaryan Oberoi |Subir Ghosh |Shalini Kumari |Joan M. Redwing | +3 more

AbstractThe semiconductor industry is transitioning to the ‘More Moore’ era, driven by the adoption of three-dimensional (3D) integration schemes surpassing the limitations of traditional two-dimensional scaling. Although innovative packaging solutions have made 3D integrated circuits (ICs) commercially viable, the inclusion of through-silicon vias and microbumps brings about increased area overhead and introduces parasitic capacitances that limit overall performance.