Thomas F. Schranghamer

Oct 8, 2024 | nature.com | Subir Ghosh |Yikai Zheng |Zhiyu Zhang |Yongwen Sun |Thomas F. Schranghamer |Aaryan Oberoi | +1 more

AbstractMonolithic three-dimensional (M3D) integration is being increasingly adopted by the semiconductor industry as an alternative to traditional through-silicon via technology as a way to increase the density of stacked, heterogenous electronic components. M3D integration can also provide transistor-level partitioning and material heterogeneity. However, there are few large-area demonstrations of M3D integration using non-silicon materials.