Yikai Zheng

Oct 8, 2024 | nature.com | Subir Ghosh |Yikai Zheng |Zhiyu Zhang |Yongwen Sun |Thomas F. Schranghamer |Aaryan Oberoi | +1 more

AbstractMonolithic three-dimensional (M3D) integration is being increasingly adopted by the semiconductor industry as an alternative to traditional through-silicon via technology as a way to increase the density of stacked, heterogenous electronic components. M3D integration can also provide transistor-level partitioning and material heterogeneity. However, there are few large-area demonstrations of M3D integration using non-silicon materials.

Mar 28, 2024 | onlinelibrary.wiley.com | Yikai Zheng |Subir Ghosh |Saptarshi Das

Saptarshi Das Engineering Science and Mechanics, Penn State University, University Park, PA, 16802 USA Electrical Engineering, Penn State University, University Park, PA, 16802 USA Materials Science and Engineering, Penn State University, University Park, PA, 16802 USA Materials Research Institute, Penn State University, University Park, PA, 16802 USASearch for more papers by this author