EE Times EU

EE Times EU

Discover the essential insights, updates, and analysis you require about electronics, engineering, semiconductors, and technology both in Europe and around the world.

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  • 1 week ago | eetimes.eu | Pat Brans

    At Silicon Saxony Day 2025, held on June 17 at Dresden Airport—in the heart of Europe’s most vibrant semiconductor cluster—the theme was unmistakable: Europe’s future in chips depends on strategic collaboration, deep-tech ecosystems, and a sustainability mindset that goes beyond compliance.

  • 1 week ago | eetimes.eu | Pat Brans

    The 2025 edition of Silicon Saxony Day, held on June 17 in Dresden, Germany, spotlighted how Europe’s semiconductor ecosystem is embracing sustainability not just as a goal but as a driver of innovation. The event featured a dedicated track on green technologies and processes in chip production, highlighting the industry’s response to climate concerns and regulatory pressure.

  • 1 week ago | eetimes.eu | Pat Brans

    At Silicon Saxony Day 2025, Manuela Junghähnel, head of wafer-level system integration at Fraunhofer IZM-ASSID, laid out a roadmap that could redefine how Europe approaches advanced chip packaging on 300-mm wafers—by making 3D heterogeneous integration a pillar of technological sovereignty. On June 17, 2025, at Silicon Saxony Day in Dresden, Germany, Junghähnel stepped onto the Smart Systems stage with a mission that went well beyond technology.

  • 1 week ago | eetimes.eu | Pat Brans

    In a move signaling Europe’s growing prominence in semiconductor innovation, Applied Materials and CEA-Leti have announced an expansion of their joint lab in Grenoble, France, to focus on full-flow development of specialty chips. The announcement, made after a signing event attended by both companies’ CEOs, underscores the rising importance of IoT, communications, automotive, power, and sensor (ICAPS) technologies in powering the infrastructure of the AI era.

  • 2 weeks ago | eetimes.eu | Barbara Della Porta

    At Computex 2025, Kevin Su, Vice President of Compuware, introduced a range of innovative power solutions designed to meet the demands of high-performance AI and GPU computing. These include the MCPS series, ranging from 1200W to 3200W, a 6600W hybrid 54V+12V PSU, liquid-cooled power solutions, and a 33,000W Power Shelf for AI Rack. Su emphasized five key technological focuses: high power density, energy efficiency, system stability, power management, and 24/7 operational reliability.

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